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參數(shù)資料
| 型號： | MHI0402CTED39NJ |
| 廠商： | KOA SPEER ELECTRONICS INC |
| 元件分類： | 通用定值電感 |
| 英文描述： | 1 ELEMENT, 0.039 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD |
| 文件頁數(shù)： | 4/5頁 |
| 文件大小： | 657K |
| 代理商： | MHI0402CTED39NJ |
TELEPHONE:
814-362-5536
FAX: 814-362-8883
76
SPEER ELECTRONICS, INC.
PARAMETER
REQUIREMENT
TEST METHOD
Operating Temperature
-550C+1250C
Storage Temperature
400C @ 70% Humidity.
Sealed plastic bags withdesiccant
shall be used to reduce the potential
of oxidation on the terminations dur-
ing storage
Resistance to
Change in Impedance: Relative
Flux: 5-10 sec dip
to value before test
±20%.
After Flux: Air dry for 15 sec
Preheat: 1 500C
±1 0C
Preheat Time: 60 sec
Solder Temp: 260C
±5C
Dip Time: 10
±1 sec
Solderability
Solder Coverage: More than 95% of the
termination shall be covered with solder.
Leach Resistance
Appearance: There shall be no visible signs
of physical or mechanical damage (i.e. no cracks).
Terminations: Termination must not be leached
away for more than 5%.
Insulation Resistance
Insulation Resistance: Mm 1G ohms
Solvent Resistance
Change in Impedance: Relative to value
Cleaning by:
before test
±10%.
Washer: Ultrasonic washer
(100W)
Solvent: Isopropyl alcohol
Time: 3 minutes
Terminal Strength
Appearance: The terminal electrode shall not
(hanging test)
break off, nor shall there be damage to the body.
Type
W(kgf)
Time
0402
NA
0603
0.5
30 sec
±2 sec
0805
1 .0
30 sec
±2 sec
1206
1.5
30 sec
±2sec
Terminal Strength
Appearance: There shall be no evidence of
(push test)
mechanical degradations to terminals or body.
ENVIRONMENTAL & MECHANICAL CHARACTERISTICS
Flux: 5-10 sec dip
After Flux: Air dry for 15 sec
Solder Temp: 245C
±50C
Dip Time: 5
±0.5 sec
MULTILAYER FERRITE
MCB/MCP/MCI/MHI
INDUCTOR
Appearance: There shall be no cracking
Solder Coverage: More than 75% of the terminal
electrode shall be covered with solder.
The bead shall be subjected to
the following 5 steps for the period of
time shown below. The 5 steps
constitute one (1) rotation.
4 rotations shall be carried out.
1) Flux: 5-10 sec
2) After Flux: Air dry for 15 sec
3) Solder Temp: 230C
±5C
4) Dip Time: 5
±0.5 sec
5 )Cool: Air cool for 60 seconds
Type
W(kgf)
Time
0402
NA
0603
1.4
60 sec
0805
1.8
60 sec
1206
2.3
60 sec
Solder Heat
CHIP
INDUCTORS
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MHI0603-22N-JBW | 制造商:RCD 制造商全稱:RCD COMPONENTS INC. 功能描述:MULTILAYER CERAMIC CHIP INDUCTORS HIGH FREQUENCY PERFORMANCE |
| MHI0603-22N-JTW | 制造商:RCD 制造商全稱:RCD COMPONENTS INC. 功能描述:MULTILAYER CERAMIC CHIP INDUCTORS HIGH FREQUENCY PERFORMANCE |
| MHI0603-22N-KBW | 制造商:RCD 制造商全稱:RCD COMPONENTS INC. 功能描述:MULTILAYER CERAMIC CHIP INDUCTORS HIGH FREQUENCY PERFORMANCE |
| MHI0603-22N-KTW | 制造商:RCD 制造商全稱:RCD COMPONENTS INC. 功能描述:MULTILAYER CERAMIC CHIP INDUCTORS HIGH FREQUENCY PERFORMANCE |
| MHI0603-22N-SBW | 制造商:RCD 制造商全稱:RCD COMPONENTS INC. 功能描述:MULTILAYER CERAMIC CHIP INDUCTORS HIGH FREQUENCY PERFORMANCE |
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