參數(shù)資料
型號: MIC2007YML
廠商: MICREL INC
元件分類: 電源管理
英文描述: Adjustable Current Limit Power Distribution Switch
中文描述: 1-CHANNEL POWER SUPPLY SUPPORT CKT, DSO6
封裝: 2 X 2 MM, LEAD FREE, MLF-6
文件頁數(shù): 16/25頁
文件大?。?/td> 410K
代理商: MIC2007YML
Micrel, Inc.
MIC20XX Family
January 2009
23
M9999-012109-A
Power Dissipation
Power dissipation depends on several factors such as
the load, PCB layout, ambient temperature, and supply
voltage. Calculation of power dissipation can be
accomplished by the following equation:
()2
OUT
DS(ON)
D
I
R
P
×
=
To relate this to junction temperature, the following
equation can be used:
A
A)
-
(J
D
J
T
R
P
T
+
×
=
θ
Where: TJ = junction temperature,
TA = ambient temperature
Rθ(J-A) is the thermal resistance of the package
In normal operation the switch’s Ron is low enough that
no significant I
2R heating occurs. Device heating is most
often caused by a short circuit, or very heavy load, when
a significant portion of the input supply voltage appears
across the switch’s power MOSFET. Under these
conditions the heat generated will exceed the package
and PCB’s ability to cool the device and thermal limiting
will be invoked.
In Figure 11 die temperature is plotted against IOUT
assuming a constant case temperature of 85°C. The
plots also assume a worst case RON of 140m at a die
temperature of 135°C. Under these conditions it is clear
that an SOT-23 packaged device will be on the verge of
thermal shutdown, typically 140°C die temperature,
when operating at a load current of 1.25A. For this
reason we recommend using MLF
packaged switch s
for any design intending to supply continuous currents of
1A or more.
0
20
40
60
80
100
120
140
160
0.2
OUTPUT CURRENT (A)
Die Temperature vs.
Output Current (TCASE=85°C)
SOT-23
0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
MLF
Figure 11. Die Temperature vs. IOUT
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