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參數(shù)資料
| 型號(hào)： | MIC2017 |
| 廠商： | Micrel Semiconductor,Inc. |
| 元件分類： | 熱切換/電源分布 |
| 英文描述： | Adjustable Current Limit Power Distribution Switch |
| 中文描述： | 可調(diào)的限流配電開關(guān) |
| 文件頁數(shù)： | 8/17頁 |
| 文件大?。?/td> | 748K |
| 代理商： | MIC2017 |
Micrel
MIC2007/MIC2017
October 2005
16
M9999-102805
equation can be used:
A
A)
-
(J
D
J
T
R
P
T
+
×
=
θ
Where: TJ = junction temperature,
TA = ambient temperature
Rθ(J-A) is the thermal resistance of the package
In normal operation, the MIC2007/2017’s Ron is low
enough that no significant I
2R heating occurs. Device
heating is most often caused by a short circuit — or very
heavy load — when a significant portion of the input
supply voltage appears across the MIC2007/2017’s
power MOSFET. Under these conditions, the heat
generated will exceed the package and PCB’s ability to
cool the device and thermal limiting will be invoked.
In Figure 10, die temperature is plotted against IOUT
assuming a constant case temperature of 85°C. The
plots also assume a worst case RON of 140 m at a die
temperature of 135°C. Under these conditions, it is clear
that an SOT-23 packaged device will be on the verge of
thermal shutdown (typically 145°C die temperature)
when operating at a load current of 1.25A. For this
reason, it is recommend that MLF package be used for
any
MIC2007/2017
designs
intending
to
supply
continuous currents of 1A or more.
Die Temperature vs. Iout for Tcase = 85°C
0
20
40
60
80
100
120
140
160
0.20 0.40 0.60 0.80 1.00 1.20 1.40 1.60 1.80 2.00
Iout - Amps
D
ie
T
em
p
er
at
u
re
-°
C
SOT-23
MLF
Figure 10. Die Temperature vs. Package
Figure 10 assumes no backside contact is made to the
thermal pad provided on the MLF package. For optimal
performance at higher current levels, or in higher
temperature environments, thermal contact with the
PCB and the exposed power paddle on the back side of
the MLF package should be made. This significantly
reduces the package’s thermal resistance thereby
extending the MIC2007/2017’s operating range. It
should be noted that this backside paddle is electrically
active and is connected to the MIC2007/2017’s GND
pin.
2 Vias
0.3 mm diam.
to Ground Plane
0.8 mm
1.4 mm
Figure 11. Pad for Thermal Mounting to PCB
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| MIC2017YM6 | 功能描述:IC DISTRIBUTION SW ADJ SOT23-6 RoHS:是 類別:集成電路 (IC) >> PMIC - 電源分配開關(guān) 系列:- 特色產(chǎn)品:XRP252 Switches 標(biāo)準(zhǔn)包裝:1 系列:- 類型:高端開關(guān) 輸出數(shù):2 Rds（開）:140 毫歐 內(nèi)部開關(guān):是 電流限制:1.15A 輸入電壓:1.75 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:10-WFDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:10-TDFN（3x3） 包裝:Digi-Reel® 其它名稱:1016-1691-6 |
| MIC2017YM6 TR | 功能描述:電源開關(guān) IC - USB Programmable Current Limit Single High-Side Switch w/Kickstart - Lead Free RoHS:否 制造商:Micrel 電源電壓-最小:2.7 V 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:SOIC-8 封裝:Tube |
| MIC2017YM6-TR | 功能描述:IC SW DISTRIBUTION ADJ SOT23-6 制造商:microchip technology 系列:- 包裝:剪切帶（CT） 零件狀態(tài):有效 開關(guān)類型:通用 輸出數(shù):1 比率 - 輸入:輸出:1:1 輸出配置:高端 輸出類型:P 通道 接口:開/關(guān) 電壓 - 負(fù)載:2.5 V ~ 5.5 V 電壓 - 電源（Vcc/Vdd）:不需要 電流 - 輸出（最大值）:2A 導(dǎo)通電阻（典型值）:70 毫歐 輸入類型:非反相 特性:負(fù)載釋放，壓擺率受控型 故障保護(hù):限流（可調(diào)），超溫 工作溫度:-40°C ~ 85°C（TA） 封裝/外殼:SOT-23-6 供應(yīng)商器件封裝:SOT-23-6 標(biāo)準(zhǔn)包裝:1 |
| MIC2017YM6TX | 功能描述:IC DISTRIBUTION SW ADJ SOT23-6 RoHS:是 類別:集成電路 (IC) >> PMIC - 電源分配開關(guān) 系列:- 特色產(chǎn)品:XRP252 Switches 標(biāo)準(zhǔn)包裝:1 系列:- 類型:高端開關(guān) 輸出數(shù):2 Rds（開）:140 毫歐 內(nèi)部開關(guān):是 電流限制:1.15A 輸入電壓:1.75 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:10-WFDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:10-TDFN（3x3） 包裝:Digi-Reel® 其它名稱:1016-1691-6 |
| MIC2017YML | 制造商:MICREL 制造商全稱:Micrel Semiconductor 功能描述:Adjustable Current Limit Power Distribution Switch |
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