參數(shù)資料
型號(hào): MIC5212-SJBM
廠商: MICREL INC
元件分類: 基準(zhǔn)電壓源/電流源
英文描述: Dual 500mA LDO Regulator
中文描述: DUAL OUTPUT, FIXED POSITIVE LDO REGULATOR, PDSO8
封裝: SOIC-8
文件頁數(shù): 7/9頁
文件大?。?/td> 171K
代理商: MIC5212-SJBM
April 2003
7
MIC5212
MIC5212
Applications Information
Input Capacitor
A 1
μ
F capacitor should be placed from IN to GND if there is
more than 10 inches of wire between the input and the AC
filter capacitor or if a battery is used as the input.
Output Capacitor
An output capacitor is required between OUT and GND to
prevent oscillation. 1.0
μ
F minimum is recommended. Larger
values improve the regulator
s transient response. The out-
put capacitor value may be increased without limit.
The output capacitor should have an ESR (Effective Series
Resistance) of about 5
or less and a resonant frequency
above 1MHz. Ultra-low-ESR capacitors may cause a low-
amplitude oscillation and/or underdamped transient response.
Most tantalum or aluminum electrolytic capacitors are ad-
equate; film types will work, but are more expensive. Since
many aluminum electrolytic capacitors have electrolytes that
freeze at about
30
°
C, solid tantalum capacitors are recom-
mended for operation below
25
°
C.
At lower values of output current, less output capacitance is
required for output stability. The capacitor can be reduced to
0.47
μ
F for current below 10mA or 0.33
μ
F for currents below
1mA.
No-Load Stability
The MIC5212 will remain stable and in regulation with no load
(other than the internal voltage divider) unlike many other
voltage regulators. This is especially important in CMOS
RAM keep-alive applications.
Dual-Supply Operation
When used in dual supply systems where the regulator load
is returned to a negative supply, the output voltage must be
diode clamped to ground.
Power SO-8 Thermal Characteristics
One of the secrets of the MIC5212
s performance is its power
SO-8 package featuring half the thermal resistance of a
standard SO-8 package. Lower thermal resistance means
more output current or higher input voltage for a given
package size.
Micrel
Lower thermal resistance is achieved by joining the four
ground leads with the die attach paddle to create a single-
piece electrical and thermal conductor. This concept has
been used by MOSFET manufacturers for years, proving
very reliable and cost effective for the user.
Thermal resistance consists of two main elements,
θ
JC
(junction-to-case thermal resistance) and
θ
CA
(case-to-ambi-
ent thermal resistance). See Figure 1.
θ
JC
is the resistance
from the die to the leads of the package.
θ
CA
is the resistance
from the leads to the ambient air and it includes
θ
CS
(case-to-
sink thermal resistance) and
θ
SA
(sink-to-ambient thermal
resistance).
θ
JA
θ
JC
θ
CA
printed circuit board
ground plane
heat sink area
SO-8
AMBIENT
Figure 1. Thermal Resistance
Using the power SO-8 reduces the
θ
JC
dramatically and
allows the user to reduce
θ
CA
. The total thermal resistance,
θ
JA
(junction-to-ambient thermal resistance) is the limiting
factor in calculating the maximum power dissipation capabil-
ity of the device. Typically, the power SO-8 has a
θ
JC
of
20
°
C/W, this is significantly lower than the standard SO-8
which is typically 75
°
C/W.
θ
CA
is reduced because pins 5
through 8 can now be soldered directly to a ground plane
which significantly reduces the case-to-sink thermal resis-
tance and sink to ambient thermal resistance.
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