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參數資料
| 型號： | mic5236 |
| 廠商： | Micrel Semiconductor,Inc. |
| 英文描述： | Low Quiescent Current μCap LDO Regulator(低靜態(tài)電流μCap技術低壓差穩(wěn)壓器) |
| 中文描述： | 低靜態(tài)電流LDO穩(wěn)壓器μCap（低靜態(tài)電流μCap技術低壓差穩(wěn)壓器） |
| 文件頁數： | 11/12頁 |
| 文件大?。?/td> | 94K |
| 代理商： | MIC5236 |
November 2000
11
MIC5236
MIC5236
Micrel
amount of copper can be determined by knowing the maxi-
mum power dissipation required. If the maximum ambient
temperature is 50
°
C and the power dissipation is as above,
632mW, the curve in Figure 7 shows that the required area of
copper is 25mm
2
.
The
θ
JA
of this package is ideally 63
°
C/W, but it will vary
depending upon the availability of copper ground plane to
which it is attached.
0
100
200
300
400
500
600
700
800
900
0
0.25 0.50 0.75 1.00 1.25 1.50
POWER DISSIPATION (W)
C
2
)
85
°
C
50
°
C
25
°
C
TJ = 125
°
C
Figure 7. Copper Area vs. Power-SOP
Power Dissipation (T
A
)
0
100
200
300
400
500
600
700
800
900
0
0.25 0.50 0.75 1.00 1.25 1.50
POWER DISSIPATION (W)
C
2
)
4
°
C
5
°
C
5
°
C
6
°
C
7
C
8
°
C
1
°
C
Figure 8. Copper Area vs. Power-MSOP
Power Dissipation
(
T
JA
)
The same method of determining the heat sink area used for
the power-SOP-8 can be applied directly to the power-
MSOP-8. The same two curves showing power dissipation
versus copper area are reproduced for the power-MSOP-8
and they can be applied identically, see Figures 8 and 9.
0
100
200
300
400
500
600
700
800
900
0
0.25 0.50 0.75 1.00 1.25 1.50
POWER DISSIPATION (W)
C
2
)
85
°
C
50
°
C 25
°
C
TJ = 125
°
C
Figure 9. Copper Area vs. Power-MSOP
Power Dissipation (T
A
)
Power MSOP-8 Thermal Characteristics
The power-MSOP-8 package follows the same idea as the
power-SO-8 package, using four ground leads with the die
attach paddle to create a single-piece electrical and thermal
conductor, reducing thermal resistance and increasing power
dissipation capability.
Quick Method
Determine the power dissipation requirements for the design
along with the maximum ambient temperature at which the
device will be operated. Refer to Figure 9, which shows safe
operating curves for three different ambient temperatures,
25
°
C, 50
°
C, and 85
°
C. From these curves, the minimum
amount of copper can be determined by knowing the maxi-
mum power dissipation required. If the maximum ambient
temperature is 50
°
C, and the power dissipation is 639mW,
the curve in Figure 9 shows that the required area of copper
is 110mm
2
,when using the power MSOP-8.
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相關代理商/技術參數 |
參數描述 |
|---|---|
| MIC5236_05 | 制造商:MICREL 制造商全稱:Micrel Semiconductor 功能描述:Low Quiescent Current μCap LDO Regulator |
| MIC5236-1.8BM | 功能描述:IC REG LDO 1.8V .15A 8-SOIC RoHS:否 類別:集成電路 (IC) >> PMIC - 穩(wěn)壓器 - 線性 系列:- 標準包裝:500 系列:- 穩(wěn)壓器拓撲結構:正，固定式 輸出電壓:12V 輸入電壓:14.5 V ~ 35 V 電壓 - 壓降（標準）:- 穩(wěn)壓器數量:1 電流 - 輸出:500mA 電流 - 限制（最?。?- 工作溫度:-40°C ~ 125°C 安裝類型:通孔 封裝/外殼:TO-205AD，TO-39-3 金屬罐 供應商設備封裝:TO-39 包裝:散裝 其它名稱:*LM78M12CH*LM78M12CH/NOPBLM78M12CH |
| MIC5236-1.8BM TR | 功能描述:IC REG LDO 1.8V .15A 8-SOIC RoHS:否 類別:集成電路 (IC) >> PMIC - 穩(wěn)壓器 - 線性 系列:- 標準包裝:500 系列:- 穩(wěn)壓器拓撲結構:正，固定式 輸出電壓:12V 輸入電壓:14.5 V ~ 35 V 電壓 - 壓降（標準）:- 穩(wěn)壓器數量:1 電流 - 輸出:500mA 電流 - 限制（最小）:- 工作溫度:-40°C ~ 125°C 安裝類型:通孔 封裝/外殼:TO-205AD，TO-39-3 金屬罐 供應商設備封裝:TO-39 包裝:散裝 其它名稱:*LM78M12CH*LM78M12CH/NOPBLM78M12CH |
| MIC5236-1.8BMM | 功能描述:IC REG LDO 1.8V .15A 8-MSOP RoHS:否 類別:集成電路 (IC) >> PMIC - 穩(wěn)壓器 - 線性 系列:- 標準包裝:500 系列:- 穩(wěn)壓器拓撲結構:正，固定式 輸出電壓:12V 輸入電壓:14.5 V ~ 35 V 電壓 - 壓降（標準）:- 穩(wěn)壓器數量:1 電流 - 輸出:500mA 電流 - 限制（最?。?- 工作溫度:-40°C ~ 125°C 安裝類型:通孔 封裝/外殼:TO-205AD，TO-39-3 金屬罐 供應商設備封裝:TO-39 包裝:散裝 其它名稱:*LM78M12CH*LM78M12CH/NOPBLM78M12CH |
| MIC5236-1.8BMM TR | 功能描述:IC REG LDO 1.8V .15A 8-MSOP RoHS:否 類別:集成電路 (IC) >> PMIC - 穩(wěn)壓器 - 線性 系列:- 標準包裝:500 系列:- 穩(wěn)壓器拓撲結構:正，固定式 輸出電壓:12V 輸入電壓:14.5 V ~ 35 V 電壓 - 壓降（標準）:- 穩(wěn)壓器數量:1 電流 - 輸出:500mA 電流 - 限制（最?。?- 工作溫度:-40°C ~ 125°C 安裝類型:通孔 封裝/外殼:TO-205AD，TO-39-3 金屬罐 供應商設備封裝:TO-39 包裝:散裝 其它名稱:*LM78M12CH*LM78M12CH/NOPBLM78M12CH |
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