參數(shù)資料
型號: MICRF213
廠商: Micrel Semiconductor,Inc.
英文描述: 1.8 V single UART, 20 Mbit/s (max.) with 128-byte FIFOs, infrared (IrDA), and XScale VLIO bus interface, SOT617-1 (HVQFN32), Tray Pack, Bakeable, Multiple
中文描述: 3.3,QwikRadio系列㈢315MHz的接收器
文件頁數(shù): 9/16頁
文件大小: 850K
代理商: MICRF213
Micrel, Inc.
MICRF213
Please keep in mind that these suggested values may
be different if the layout is not exactly the same as the
one depicted here.
May 2007
9
M9999-052307-A
(408) 944-0800
Freq (MHz)
303.825
315
345
C3 (pF)
1.8
1.8
1.8
L2 (nH)
72
68
56
Z device (
)
34.6– j245.1
32.5 – j235
25.3 – j214
Table 4. Matching Values for the
Most Used Frequencies
For the frequency of 315MHz, the input impedance is
Z = 32.5 – j235
, then the matching components are
calculated by:
Equivalent parallel = B = 1/Z = 0.577 + j4.175
msiemens
Rp = 1 / Re (B);
Rp = 1.733 k
;
Q = SQRT (Rp/50 + 1)
Q = 5.972
Xm = Rp / Q
Xm = 290.21
Resonance Method For L-shape Matching Network
Lc = Xp / (2.Pi.f);
L2 = (Lc.Lp) / (Lc + Lp);
L2 = 66.3nH
C3 = 1.74pF
Doing the same calculation example with the Smith
Chart, it would appear as follows,
First, we plot the input impedance of the device,
(Z = 32.5 – j235)
@ 315MHz.(Figure 4).
Xp = 1 / Im (B)
Xp = 239.5
Lp = Xm / (2.Pi.f)
C3 = 1 / (2.Pi.f.Xm)
Figure 4. Device’s Input Impedance, Z = 32.5 – j235
Second, we plot the shunt inductor (68nH) and the
series capacitor (1.8pF) for the desired input
impedance (Figure 5). We can see the matching
leading to the center of the Smith Chart or close to
50
.
Figure 5. Plotting the Shunt Inductor
and Series Capacitor
Crystal Y1 or Y1A (SMT or leaded respectively) is the
reference clock for all the device internal circuits.
Desired crystal characteristics are: 10pF load
capacitance, 30ppm, ESR < 50
and a -40oC to
+105oC temperature range. Table 5 shows the crystal
frequencies and one of Micrel’s approved crystal
manufactures (www.hib.com.br).
The oscillator of the MICRF213 is a Colpitts type. It is
very sensitive to stray capacitance loads. Thus, very
good care must be taken when laying out the printed
circuit board. Avoid long traces and ground plane on
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