
ML2281, ML2282, ML2284, ML2288
26
REV. 1.0 10/10/2000
ORDERING INFORMATION
ALTERNATE
PART NUMBER
TOTAL
TEMPERATURE
RANGE
PART NUMBER
UNADJUSTED ERROR
PACKAGE
SINGLE ANALOG INPUT, 8-PIN PACKAGE
ML2281BIP (Obsolete)
ML2281BCP
ML2281BCS (Obsolete
ADC0831CCN
ADC0831BCN
—
±
1/2 LSB
–
40
°
C to 85
°
C
0
°
C to 70
°
C
0
°
C to 70
°
C
Plastic DIP (P08)
Molded DIP (P08)
Plastic SOIC (S08)
ML2281CIP (End of Life)
ML2281CCP (End of Life)
ML2281CCS (End of Life)
ADC0831BCN
ADC0831CCN
—
±
1 LSB
–
40
°
C to 85
°
C
0
°
C to 70
°
C
0
°
C to 70
°
C
Plastic DIP (P08)
Molded DIP (P08)
Plastic SOIC (S08)
TWO ANALOG INPUTS, 8-PIN PACKAGE
ML2282BIP (Obsolete)
ML2282BCP (Obsolete)
ML2282BCS (Obsolete)
ADC0832CCN
ADC0832BCN
—
±
1/2 LSB
–
40
°
C to 85
°
C
0
°
C to 70
°
C
0
°
C to 70
°
C
Plastic DIP (P08)
Molded DIP (P08)
Plastic SOIC (S08)
ML2282CIP (Obsolete)
ML2282CCP (Obsolete)
ML2282CCS (Obsolete)
ADC0832BCN
ADC0832CCN
—
±
1 LSB
–
40
°
C to 85
°
C
0
°
C to 70
°
C
0
°
C to 70
°
C
Plastic DIP (P08)
Molded DIP (P08)
Plastic SOIC (S08)
FOUR ANALOG INPUTS, 14-PIN PACKAGE
ML2284BIP (Obsolete)
ML2284BCP (Obsolete)
ML2284BCS (Obsolete)
ADC0834CCN
ADC0834BCN
—
±
1/2 LSB
–
40
°
C to 85
°
C
0
°
C to 70
°
C
0
°
C to 70
°
C
Plastic DIP (P14)
Molded DIP (P14)
Plastic SOIC (S14)
ML2284CIP (Obsolete)
ML2284CCP (End of Life)
ML2284CCS (Obsolete)
ADC0834BCN
ADC0834CCN
—
±
1 LSB
–
40
°
C to 85
°
C
0
°
C to 70
°
C
0
°
C to 70
°
C
Plastic DIP (P14)
Molded DIP (P14)
Plastic SOIC (S14)
EIGHT ANALOG INPUTS, 20-PIN PACKAGE
ML2288BIP (Obsolete)
ML2288BCP (Obsolete)
ML2288BCQ (Obsolete)
ADC0838CCN
ADC0838BCN
ADC0838BCV
±
1/2 LSB
–
40
°
C to 85
°
C
0
°
C to 70
°
C
0
°
C to 70
°
C
Plastic DIP (P20)
Molded DIP (P20)
Molded PCC (Q20)
ML2288CIP (Obsolete)
ML2288CCP (Obsolete)
ML2288CCQ (End of Life)
ADC0838CCN
ADC0838CCN
ADC0838CCV
±
1 LSB
–
40
°
C to 85
°
C
0
°
C to 70
°
C
0
°
C to 70
°
C
Plastic DIP (P20)
Molded DIP (P20)
Molded PCC (Q20)
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, and (c) whose failure to
perform when properly used in accordance with
instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
www.fairchildsemi.com
2000 Fairchild Semiconductor Corporation
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.