參數(shù)資料
型號: ML7001-03
廠商: OKI SEMICONDUCTOR CO., LTD.
元件分類: Codec
英文描述: Single Rail CODEC
中文描述: 單鐵編解碼器
文件頁數(shù): 19/19頁
文件大小: 144K
代理商: ML7001-03
Semiconductor
ML7000-01/02/03/ML7001-01/02/03
19/19
(Unit : mm)
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
SSOP20-P-250-0.95-K
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5
m
m or more
0.18 TYP.
Mirror finish
相關PDF資料
PDF描述
ML7000-01 Single Rail CODEC
ML7000-02 Single Rail CODEC
ML7000-03 Single Rail CODEC
ML7012-04 2400 bps Single Chip Full Duplex Data Modem with Protocol(2400 bps單片、全雙工、V.22bis,V.22,V.21.Modern)
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