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參數(shù)資料
| 型號： | MLG1608B47NJ |
| 元件分類： | 通用定值電感 |
| 英文描述： | 1 ELEMENT, 0.047 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD |
| 文件頁數(shù)： | 1/2頁 |
| 文件大?。?/td> | 33K |
| 代理商： | MLG1608B47NJ |
All specifications are subject to change without notice.
(1/2)
001-01 / 20021008 / e521_mlg1608.fm
Inductors
For High Frequency
SMD
MLG Series MLG1608 Type
FEATURES
Supports operating frequency bands of up to 10GHz with nomi-
nal inductance values from 1 to 100nH.
Provides high Q characteristics.
Advanced monolithic structure is formed using a multilayering
and sintering process with ceramic and conductive materials for
high-frequency.
APPLICATIONS
For high-frequency applications including mobile phones, portable
phones, cordless phones, pagers and personal handy-phone sys-
tems (PHS).
SHAPES AND DIMENSIONS
RECOMMENDED PC BOARD PATTERN
SPECIFICATIONS
Operating temperature range
Storage temperature range
RECOMMENDED REFLOW SOLDERING CONDITIONS
PRODUCT IDENTIFICATION
MLG 1608 B 2N2
(1)
(2)
(3) (4)
(1) Series name
(2) Dimensions L
×
W
1608
(3) Material code
(4) Inductance value
2N2
12N
39N
(5) Inductance tolerance
S
D
J
(6) Packaging style
T
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
HANDLING AND PRECAUTIONS
Before soldering, be sure to preheat components.
The preheating temperature should be set so that the tempera-
ture difference between the solder temperature and product
temperature does not exceed 150°C.
After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
260°C. Soldering time should not exceed 3 seconds.
–25 to +85°C
–40 to +85°C [Unit of products]
1.6±0.15
0.3±0.2
0
0
Weight: 4mg
0
0.7
0.7
0.7
Dimensions in mm
10s max.
40s max.
Preheating 60 to 120s min.
Natural
cooling
230C
200C
150C
Time(s)
1.6
×
0.8mm
2.2nH
12nH
39nH
±0.3nH
±0.5nH
±5%
Taping (reel)
Quantity
4000 pieces/reel
S
(5) (6)
T
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| MLG1608B47NJT | 制造商:TDK 功能描述:Inductor SMD MLG 0603 47nH 400mA 制造商:TDK 功能描述:Inductor SMD 47nH 400mA |
| MLG1608B47NJT000 | 功能描述:47nH Unshielded Multilayer Inductor 400mA 600 mOhm Max 0603 (1608 Metric) 制造商:tdk corporation 系列:MLG 包裝:剪切帶（CT） 零件狀態(tài):生命周期結束 類型:多層 材料 - 磁芯:無磁性 電感:47nH 容差:±5% 額定電流:400mA 電流 - 飽和值:- 屏蔽:無屏蔽 DC 電阻（DCR）:600 毫歐最大 不同頻率時的 Q 值:14 @ 100MHz 頻率 - 自諧振:1.4GHz 等級:- 工作溫度:-55°C ~ 125°C 頻率 - 測試:100MHz 安裝類型:表面貼裝 封裝/外殼:0603（1608 公制） 大小/尺寸:0.063" 長 x 0.031" 寬（1.60mm x 0.80mm） 高度 - 安裝（最大值）:0.037"（0.95mm） 標準包裝:1 |
| MLG1608B47NJTD08 | 制造商:TDK 功能描述: |
| MLG1608B47NJTD25 | 功能描述:47nH Unshielded Multilayer Inductor 400mA 600 mOhm Max 0603 (1608 Metric) 制造商:tdk corporation 系列:MLG 包裝:剪切帶（CT） 零件狀態(tài):生命周期結束 類型:多層 材料 - 磁芯:無磁性 電感:47nH 容差:±5% 額定電流:400mA 電流 - 飽和值:- 屏蔽:無屏蔽 DC 電阻（DCR）:600 毫歐最大 不同頻率時的 Q 值:14 @ 100MHz 頻率 - 自諧振:1.4GHz 等級:AEC-Q200 工作溫度:-55°C ~ 125°C 頻率 - 測試:100MHz 安裝類型:表面貼裝 封裝/外殼:0603（1608 公制） 大小/尺寸:0.063" 長 x 0.031" 寬（1.60mm x 0.80mm） 高度 - 安裝（最大值）:0.037"（0.95mm） 標準包裝:1 |
| MLG1608B4N7S | 功能描述:固定電感器 4.7nH +-0.3nH RoHS:否 制造商:AVX 電感:10 uH 容差:20 % 最大直流電流:1 A 最大直流電阻:0.075 Ohms 工作溫度范圍:- 40 C to + 85 C 自諧振頻率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接類型:SMD/SMT 封裝 / 箱體:6.6 mm x 4.45 mm |
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