MLX90316
Rotary Position Sensor IC
3901090316
Rev. 003
Page 5 of 41
Data Sheet
April 07
14.6.
14.6.1.
14.6.2.
14.7.
14.7.1.
14.7.2.
15.
MLX90316 SELF DIAGNOSTIC..........................................................................................................25
P
ROGRAMMABLE
D
IAGNOSTIC
S
ETTINGS
.................................................................................................24
RESONFAULT Parameter...................................................................................................................24
EEHAMHOLE Parameter....................................................................................................................24
L
OCK
.........................................................................................................................................................24
MLXLOCK Parameter .........................................................................................................................24
LOCK Parameter .................................................................................................................................24
16.
SERIAL PROTOCOL...........................................................................................................................27
16.1.
I
NTRODUCTION
.........................................................................................................................................27
16.2.
SERIAL
PROTOCOL
M
ODE
...................................................................................................................27
16.3.
MOSI
(M
ASTER
O
UT
S
LAVE
I
N
)...............................................................................................................27
16.4.
MISO
(M
ASTER
I
N
S
LAVE
O
UT
)...............................................................................................................27
16.5.
/SS
(S
LAVE
S
ELECT
).................................................................................................................................27
16.6.
M
ASTER
S
TART
-U
P
...................................................................................................................................27
16.7.
S
LAVE
S
TART
-U
P
......................................................................................................................................27
16.8.
T
IMING
......................................................................................................................................................28
16.9.
S
LAVE
R
ESET
............................................................................................................................................29
16.10.
F
RAME
L
AYER
..........................................................................................................................................29
16.10.1.
Command Device Mechanism..........................................................................................................29
16.10.2.
Data Frame Structure ......................................................................................................................29
16.10.3.
Timing ..............................................................................................................................................29
16.10.4.
Data Structure..................................................................................................................................30
16.10.5.
Angle Calculation.............................................................................................................................30
16.10.6.
Error Handling.................................................................................................................................30
17.
RECOMMENDED APPLICATION DIAGRAMS..................................................................................31
17.1.
A
NALOG
O
UTPUT
W
IRING WITH THE
MLX90316
IN
SOIC
P
ACKAGE
.......................................................31
17.2.
A
NALOG
O
UTPUT
W
IRING WITH THE
MLX90316
IN
TSSOP
P
ACKAGE
....................................................31
17.3.
PWM
L
OW
S
IDE
O
UTPUT
W
IRING
............................................................................................................32
17.4.
S
ERIAL
P
ROTOCOL
....................................................................................................................................32
17.4.1.
SPI Version – Single Die......................................................................................................................32
17.4.2.
SPI Version – Dual Die........................................................................................................................33
17.4.3.
Non SPI Version (Standard Version)....................................................................................................34
18.
STANDARD INFORMATION REGARDING MANUFACTURABILITY OF MELEXIS PRODUCTS
WITH DIFFERENT SOLDERING PROCESSES........................................................................................35
19.
ESD PRECAUTIONS...........................................................................................................................35
20.
PACKAGE INFORMATION.................................................................................................................36
20.1.
SOIC8
-
P
ACKAGE
D
IMENSIONS
...............................................................................................................36
20.2.
SOIC8
-
P
INOUT AND
M
ARKING
...............................................................................................................36
20.3.
SOIC8
-
IMC
P
OSITIONNING
.....................................................................................................................37
20.4.
TSSOP16
-
P
ACKAGE
D
IMENSIONS
...........................................................................................................38
20.5.
TSSOP16
-
P
INOUT AND
M
ARKING
..........................................................................................................39
20.6.
TSSOP16
-
IMC
P
OSITIONNING
................................................................................................................39
21.
DISCLAIMER.......................................................................................................................................41