
MLX90316
Rotary Position Sensor IC
3901090316
Rev. 001
Page 4 of 34
Data Sheet
4 October 05
14.6.
14.6.1.
14.6.2.
15.
MLX90316 SELF DIAGNOSTIC..........................................................................................................19
L
OCK
.........................................................................................................................................................18
MLXLOCK Parameter .........................................................................................................................18
LOCK Parameter .................................................................................................................................18
16.
SERIAL PROTOCOL...........................................................................................................................21
16.1.
I
NTRODUCTION
.........................................................................................................................................21
16.2.
SERIAL
PROTOCOL
M
ODE
...................................................................................................................21
16.3.
MOSI
(M
ASTER
O
UT
S
LAVE
I
N
)...............................................................................................................21
16.4.
MISO
(M
ASTER
I
N
S
LAVE
O
UT
)...............................................................................................................21
16.5.
/SS
(S
LAVE
S
ELECT
).................................................................................................................................21
16.6.
M
ASTER
S
TART
-
UP
...................................................................................................................................21
16.7.
S
LAVE
S
TART
-
UP
......................................................................................................................................21
16.8.
T
IMING
......................................................................................................................................................22
16.9.
S
LAVE
R
ESET
............................................................................................................................................23
16.10.
F
RAME
L
AYER
..........................................................................................................................................23
16.10.1.
Command Device Mechanism..........................................................................................................23
16.10.2.
Data Frame Structure ......................................................................................................................23
16.10.3.
Timing ..............................................................................................................................................23
16.10.4.
Data Structure..................................................................................................................................24
16.10.5.
Angle Calculation.............................................................................................................................24
16.10.6.
Error Handling.................................................................................................................................24
17.
RECOMMENDED APPLICATION DIAGRAMS..................................................................................25
17.1.
A
NALOG
O
UTPUT
W
IRING WITH THE
MLX90316
IN
SOIC
P
ACKAGE
.......................................................25
17.2.
A
NALOG
O
UTPUT
W
IRING WITH THE
MLX90316
IN
TSSOP
P
ACKAGE
....................................................25
17.3.
PWM
L
OW
S
IDE
O
UTPUT
W
IRING
............................................................................................................26
17.4.
S
ERIAL
P
ROTOCOL
....................................................................................................................................26
18.
STANDARD INFORMATION REGARDING MANUFACTURABILITY OF MELEXIS PRODUCTS
WITH DIFFERENT SOLDERING PROCESSES........................................................................................28
19.
ESD PRECAUTIONS...........................................................................................................................28
20.
PACKAGE INFORMATION.................................................................................................................29
20.1.
SOIC8
-
P
ACKAGE
D
IMENSIONS
...............................................................................................................29
20.2.
SOIC8
-
P
INOUT AND
M
ARKING
...............................................................................................................29
20.3.
SOIC8
-
IMC
P
OSITIONNING
.....................................................................................................................30
20.4.
TSSOP16
-
P
ACKAGE
D
IMENSIONS
...........................................................................................................31
20.5.
TSSOP16
-
P
INOUT AND
M
ARKING
..........................................................................................................32
20.6.
TSSOP16
-
IMC
P
OSITIONNING
................................................................................................................32
21.
DISCLAIMER.......................................................................................................................................34