參數(shù)資料
型號: MMA3201D
廠商: 飛思卡爾半導體(中國)有限公司
英文描述: Surface Mount Micromachined Accelerometer(表面安裝微電機加速計)
中文描述: 表面貼裝微加速度計(表面安裝微電機加速計)
文件頁數(shù): 7/8頁
文件大?。?/td> 172K
代理商: MMA3201D
Motorola Sensor Device Data
MMA3201D
7
PACKAGE DIMENSIONS
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct footprint,
the packages will self-align when subjected to a solder reflow
process. It is always recommended to design boards with a
solder mask layer to avoid bridging and shorting between solder
pads.
Figure 5. Footprint SOIC-20 (Case 475A-01)
-T-
C
K
G
SEATING
CASE 475A-01
ISSUE A
20-LEAD SOIC
DATE 10/01/03
1
10
20
11
-B-
-A-
P
10 PL
0.13 (0.005)
D
20 PL
M
A
M
B
M
T
M
A
M
0.13 (0.005)
B
M
T
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
DIM
A
B
C
D
F
G
J
K
M
P
R
MIN
12.67
7.40
3.30
0.35
0.76
MAX
12.96
7.60
3.55
0.49
1.14
MILLIMETERS
1.27 BSC
0.25
0.10
0
10.16
0.25
0.32
0.25
7
10.67
0.75
R
X 45
J
F
M
0.380 in.
9.65 mm
0.050 in.
1.27 mm
0.024 in.
0.610 mm
0.080 in.
2.03 mm
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
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