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參數(shù)資料
| 型號： | MMA6280QR2 |
| 廠商： | 飛思卡爾半導體(中國)有限公司 |
| 英文描述： | 【1.5 g - 6 g Dual Axis Low-g Micromachined Accelerometer |
| 中文描述： | 【1.5克- 6克雙三軸低g加速度計 |
| 文件頁數(shù)： | 7/12頁 |
| 文件大?。?/td> | 324K |
| 代理商： | MMA6280QR2 |
Sensors
7
Freescale Semiconductor
MMA6280QT
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package.
With the correct footprint, the packages will self-align when
subjected to a solder reflow process. It is always
recommended to design boards with a solder mask layer to
avoid bridging and shorting between solder pads.
The flag underneath the package is internally connected to
ground. It is not recommended for the flag to be soldered
down.
PCB DESIGN GUIDELINES
The following are the recommended guidelines to follow
for mounting QFN sensors for either automotive or consumer
applications.
1. NSMD (Non Solder Mask Defined) is shown in
Figure 7
.
2. Solder mask opening = PCB land pad +0.1 mm.
3. Stencil aperture size = PCB land pad – 0.025mm, as
shown in
Figure 8
with a 6 mil stencil.
4. Do not place insertion components or vias at a
distance less than 2mm from the package land area.
5. Signal trace connected to pads should be as
symmetric as possible. Put dummy traces if there is
NC pads, in order to have same length of exposed
trace for all pads. Signal traces with 0.1mm width and
min. 0.5mm length for all PCB land pad near package
are recommended as shown in
Figure 7
and
Figure 8
. Wider trace can be continued after the
0.5mm zone.
6. Use a standard pick and place process and
equipment (no hand soldering process).
7. It is recommended to use a cleanable solder paste
with an additional cleaning step after SMT mount
8. It is recommended to avoid screwing down the PCB
to fix it into an enclosure since this may cause the
PCB to bend.
9. PC boards should be rated for multiple reflow of lead-
free conditions with 260°C maximum temperature.
Figure 7. NSMD Solder Mask Design Guidelines
Do not solder down flag for
consumer application
Do not place metal pattern or via
structures underneath of package
0.55 mm
0.50 mm
Package Pad
PCB land pattern - NSMD
Cu: 0.55 x 0.50 mm sq.
Solder mask opening =
PCB land pad +0.1mm
=0.65x0.60 mm sq.
Signal trace 0.1mm width
and 0.5mm (min) length near
package. Wider trace can be
continued after these traces.
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| MMA710-SOT89TR | 0.1 MHz - 4000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
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| MMA7260QT_07 | 【1.5g - 6g Three Axis Low-g Micromachined Accelerometer |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| MMA6280QT | 功能描述:加速計 - 板上安裝 1.5 XZ QFN 16 LD RoHS:否 制造商:Murata 傳感軸:Double 加速:12 g 靈敏度: 封裝 / 箱體: 輸出類型:Analog 數(shù)字輸出 - 位數(shù):11 bit 電源電壓-最大:5.25 V 電源電壓-最小:4.75 V 電源電流:4 mA 最大工作溫度:+ 125 C 最小工作溫度:- 40 C |
| MMA6280QT | 制造商:Freescale Semiconductor 功能描述:IC ACCELERATION SENSOR XZ 1.5G |
| MMA6280QT_08 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:【1.5 g - 6 g Dual Axis Low-g Micromachined Accelerometer |
| MMA6281QR2 | 功能描述:加速計 - 板上安裝 2.5G XZ QFN 16 LEADS 6X6 RoHS:否 制造商:Murata 傳感軸:Double 加速:12 g 靈敏度: 封裝 / 箱體: 輸出類型:Analog 數(shù)字輸出 - 位數(shù):11 bit 電源電壓-最大:5.25 V 電源電壓-最小:4.75 V 電源電流:4 mA 最大工作溫度:+ 125 C 最小工作溫度:- 40 C |
| MMA6281QT | 功能描述:加速計 - 板上安裝 2.5 - 10G XZ QFN RoHS:否 制造商:Murata 傳感軸:Double 加速:12 g 靈敏度: 封裝 / 箱體: 輸出類型:Analog 數(shù)字輸出 - 位數(shù):11 bit 電源電壓-最大:5.25 V 電源電壓-最小:4.75 V 電源電流:4 mA 最大工作溫度:+ 125 C 最小工作溫度:- 40 C |
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