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參數(shù)資料
| 型號： | MNA14 |
| 廠商： | Rohm CO.,LTD. |
| 英文描述： | Multi-layer Ceramic Chip Capacitors Networks(多層陶瓷電容) |
| 中文描述： | 多層陶瓷電容網(wǎng)絡(luò)（多層陶瓷電容） |
| 文件頁數(shù)： | 3/8頁 |
| 文件大小： | 105K |
| 代理商： | MNA14 |
MNA14
Ceramic capacitors
!
Characteristics
: 235 ± 5
C
: 2 ± 0.5s
: 260 ± 5
C
: 5 ± 0.5s
: 150 ± 10
C for 1 to 2 min.
-55
C~ + 125
C
A (C0G)
Temperature characteristics
Item
Operating temperature
Nominal capacitance (C)
Dissipation factor (Tan
δ)
Insulation resistance (IR)
Withstanding voltage
Temperature characteristics
Terminal adherence
Resistance
to vibration
Appearance
Rate of capacitance change
Dissipation factor (Tan
δ)
Solderability
Resistance
to soldering
heat
Appearance
Rate of capacitance change
Dissipation factor (Tan
δ)
Insulation resistance
Withstanding voltage
Temperature
cycling
Appearance
Rate of capacitance change
Dissipation factor (Tan
δ)
Insulation resistance
Humidity load
test
Appearance
Rate of capacitance change
Dissipation factor (Tan
δ)
Insulation resistance
High-
temperature
load test
Appearance
Rate of capacitance change
Dissipation factor (Tan
δ)
Insulation resistance
Must be within the specified tolerance range.
100 / (400 + 20C)% or less: Less than 30 pF
0.1% or less: 30 pF or larger
10,000 M
or 500M
μ
F, whichever is smaller
The insulation must not be damaged.
Within 0 ± 30ppm /
C
No detachment or signs of detachment.
There must be no mechanical damage.
Must be within initial tolerance.
Must satisfy initial specified value.
At least 3/4 of the surface of the two terminals
must be covered with new solder.
There must be no mechanical damage.
± 2.5% or ± 0.25 pF, whichever is larger
Must satisfy initial specified value.
10,000 M
or 500M
μ
F, whichever is smaller
The insulation must not be damaged.
There must be no mechanical damage.
± 2.5% or ± 0.25 pF, whichever is larger
Must satisfy initial specified value.
10,000 M
or 500M
μ
F, whichever is smaller
There must be no mechanical damage.
± 7.5% or ± 0.75 pF, whichever is larger
0.5% or less
500 M
or 25M
μ
F, whichever is smaller
There must be no mechanical damage.
± 3.0% or ± 0.3 pF, whichever is larger
0.3% or less
10,000 M
or 50M
μ
F, whichever is smaller
Test methods / conditions
(based on JIS C 5102)
Based on paragraph 7.8 and paragraph 9,
Measured at room temperature and standard humidity.
Measurement frequency : 1 ± 0.1MHz
Measurement voltage : 1 ± 0.1Vrms.
Based on paragraph 7.6.
Measurement is made after rated voltage is
applied for 60 ± 5s.
Based on paragraph 7.1.
Apply 300% of the rated voltage for 1 to 5s
then measure.
The temperature coefficients in table 12, paragraph
7.12 are calculated at 20
C and high temperature.
Based on paragraph 8.11.2.
Apply 5N (0.51 kg
·
f) for 10 ± 1s
in the direction
indicated by the arrow.
Capacitor
Test board
Chip is mounted to a board in the manner
shown on the right, subjected to vibration
(type A in paragraph 8.2), and
measured 24 ± 2 hours later.
Board
Based on paragraph 8.13,
Soldering temperature
Soldering time
Based on paragraph 8.14.
Soldering temperature
Soldering time
Preheating
Based on paragraph 9.3,
Number of cycles: 10
Capacitance measured after 24 ± 2 hrs.
Test temperature : 40 ± 2
C
Relative humidity : 90% to 95%
Applied voltage : rated voltage
Test time : 500 to 524 hrs.
Capacitance measured after 24 ± 2 hrs.
Test temperature : Max. operating temp.
Applied voltage : rated voltage x 200%
Test time : 1,000 to 1,048 hrs.
Capacitance measured after 24 ± 2 hrs.
Based on paragraph 9.9,
Based on paragraph 9.10,
Class 1 (For thermal compensation)
*The design and specifications are subject to change without prior notice. Before ordering or using, please check the latest technical specification.
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