
MP7610
6
Rev. 4.01
25
°
C
Typ
Tmin to Tmax
Min
ELECTRICAL CHARACTERISTICS (CONT’D)
Specifications aresubjectto change withoutnotice
Parameter
Symbol
Min
Max
Max
Units
Test Conditions/Comments
DIGITAL TIMING
SPECIFICATIONS
1, 4
(CONT’D
)
LD Rising Edge to SDO
Tri-state Disable
LD Rising Edge to CLK Enable
LD Set-up Time with Respect
to CLK
t
HZ2
50
ns
t
LDCK
t
LDSU
50
45
ns
ns
NOTES:
1
2
3
4
5
6
Guaranteed; not tested.
Specified values guarantee functionality.
Digital inputs should not go below digital GND or exceed DV
DD
supply voltage.
See Figures 2 and 3. All digital input signals are specified with t
R
= t
F
= 10 ns 10% to 90% and timed from a 50% voltage level.
For powersupply values <
|
2
£
V
REF
, the outputswing is limited as specified in Analog Outputs.
Digital feedthrough and channel-to-channel crosstalk are heavily dependenton the board layout and environment.
ABSOLUTE MAXIMUM RATINGS (TA = +25
°
C unless otherwise noted)
1, 2
V
CC
to AGND
V
EE
to AGND
DV
DD
to DGND
V
REF
to DGND
AGND to DGND
(Functionality guaranteed for
|
0.5 V only)
+16.5 V
. . . . . . . . . . . . . . . . . . . . . . . . . . .
--16.5 V
. . . . . . . . . . . . . . . . . . . . . . . . . . .
+6.5 V
. . . . . . . . . . . . . . . . . . . . . . . . . .
+7.0 V
. . . . . . . . . . . . . . . . . . . . . . . . . . .
+1 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Digital Input & Output Voltage
to DGND
. . . . . . . . . . . . . . . . . . . .
--0.5 to DV
DD
+0.5V
Analog Inputs & Outputs
V
CC
, V
EE
, DV
DD
, AGND, DGND (provided that power
dissipation of the package spec is not exceeded)
Operating Temperature Range
Extended Industrial
. . . . . . . . . . . . . .
Maximum J unction Temperature
Storage Temperature
. . . . . . . . . . . . . . . . . . . . . .
Lead Temperature (Soldering, 10 sec)
Package Power Dissipation Rating @ 75
°
C
SOIC, PLCC
. . . . . . . . . . . . . . . . . . . . . . . . . . .
Derates above 75
°
C
. . . . . . . . . . . . . . . . . . . .
Indefinite Shorts to
. . . . . . .
--40
°
C to +85
°
C
--65
°
C to 150
°
C
. . .
150
°
C
+300
°
C
. . . . .
1150mW
15mW/
°
C
NOTES:
1
Stresses above those listed under “Absolute MaximumRatings” may cause permanent damage to the device. This is a
stress rating only and functional operation at or above this specification is not implied. Exposure to maximum rating
conditions for extended periods may affect device reliability.
Any input pin which can see a value outside the absolute maximumratings should be protected by Schottky diode clamps
(HP5082-2835) from input pin to the supplies. All inputs have protection diodes which will protect the device fromshort
transients outside the supplies of less than 100mA for less than 100
μ
s.
2
APPLICATION NOTES
NOTE: When using these DACs to drive remote devices, the accuracy of the outputcan be improved by utilizing a remote analog
groundconnection. The differencebetweentheDGND andAGNDshouldbelimitedto
|
300mV toassurenormaloperation. Ifthere
is any chance thatthe AGND toDGND canbe greaterthan
|
1 V, we recommendtwoback-to-backdiodes be usedbetweenDGND
andAGND toclampthevoltageandpreventdamagetotheDAC. Using a bufferbetweentheremotegroundlocationandAGND may
help reduce noise induced from long lead or trace lengths.