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參數資料
| 型號： | MPC5123VY400BR |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | RISC PROCESSOR, PBGA516 |
| 封裝： | 27 X 27 MM, ROHS COMPLIANT, PLASTIC, TFBGA-516 |
| 文件頁數： | 17/86頁 |
| 文件大?。?/td> | 1266K |
| 代理商： | MPC5123VY400BR |
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MPC5121E/MPC5123 Data Sheet, Rev. 1
Electrical and Thermal Characteristics
Freescale Semiconductor
24
RθJA =RθJC+RθCA
Eqn. 4
where:
RθJA = junction to ambient thermal resistance (C/W)
RθJC = junction to case thermal resistance (C/W)
RθCA = case to ambient thermal resistance (C/W)
RθJC is device related and cannot be influenced by the user. You control the thermal environment to change the case to ambient
thermal resistance, RθCA. For instance, you can change the air flow around the device, add a heat sink, change the mounting
arrangement on printed circuit board, or change the thermal dissipation on the printed circuit board surrounding the device. This
description is most useful for ceramic packages with heat sinks where some 90% of the heat flow is through the case to the heat
sink to ambient. For most packages, a better model is required.
A more accurate thermal model can be constructed from the junction to board thermal resistance and the junction to case thermal
resistance. The junction to case covers the situation where a heat sink is used or where a substantial amount of heat is dissipated
from the top of the package. The junction to board thermal resistance describes the thermal performance when most of the heat
is conducted to the printed circuit board. This model can be used for hand estimations or for a computational fluid dynamics
(CFD) thermal model.
To determine the junction temperature of the device in the application after prototypes are available, the Thermal
Characterization Parameter (
Ψ
JT) can be used to determine the junction temperature with a measurement of the temperature at
the top center of the package case using the following equation:
TJ =TT+(ΨJT × PD)
Eqn. 5
where:
TT = thermocouple temperature on top of package (C)
Ψ
JT = thermal characterization parameter ( C / W )
PD = power dissipation in package (W)
The thermal characterization parameter is measured per JESD51-2 specification using a 40-gauge type T thermocouple epoxied
to the top center of the package case. The thermocouple should be positioned, so that the thermocouple junction rests on the
package. A small amount of epoxy is placed over the thermocouple junction and over approximately one mm of wire extending
from the junction. The thermocouple wire is placed flat against the package case to avoid measurement errors caused by cooling
effects of the thermocouple wire.
3.2
Oscillator and PLL Electrical Characteristics
The MPC5121e/MPC5123 System requires a system-level clock input SYS_XTALI. This clock input may be driven directly
from an external oscillator or with a crystal using the internal oscillator.
There is a separate oscillator for the independent Real-Time Clock (RTC) system.
The MPC5121e/MPC5123 clock generation uses two phase locked loop (PLL) blocks.
The system PLL (SYS_PLL) takes an external reference frequency and generates the internal system clock. The
system clock frequency is determined by the external reference frequency and the settings of the SYS_PLL
configuration.
The e300 core PLL (CORE_PLL) generates a master clock for all of the CPU circuitry. The e300 core clock frequency
is determined by the system clock frequency and the settings of the CORE_PLL configuration.
The USB PHY contains its own oscillator with the input USB_XTALI and an embedded PLL.
The SATA PHY contains its own oscillator with the input SATA_XTALI and an embedded PLL.
Preliminary
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相關代理商/技術參數 |
參數描述 |
|---|---|
| MPC5123YVY300B | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Advance Information |
| MPC5123YVY300BR | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Advance Information |
| MPC5123YVY400B | 功能描述:微處理器 - MPU TELEMATICS PROCESSOR RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC5123YVY400BR | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:e300 Power Architecture processor core |
| MPC5125 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MPC5125 Microcontroller |
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