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| 型號(hào)： | MPC5554INT |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 55/58頁 |
| 文件大?。?/td> | 0K |
| 描述： | BOARD DEMO MPC5554 |
| 產(chǎn)品培訓(xùn)模塊： | MPC55xx PitchPak Family |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | Qorivva |
| 類型： | MCU |
| 適用于相關(guān)產(chǎn)品： | MPC5554 |
| 所含物品： | 板 |
| 相關(guān)產(chǎn)品： | MPC5554MZP132R2-ND - IC MCU 2M FLASH 132MHZ 416-PBGA MPC5554MZP132-ND - IC MCU 2M FLASH 132MHZ 416-PBGA MPC5554MVR132R2-ND - IC MCU 2M FLASH 132MHZ 416-PBGA MPC5554MVR132-ND - IC MCU 2M FLASH 132MHZ 416-PBGA MPC5554AZP132-ND - IC MPU 2M FLASH 132MHZ 416-PBGA |
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MPC5554 Microcontroller Data Sheet, Rev. 4
Electrical Characteristics
Freescale Semiconductor
6
3.2.1
General Notes for Specifications at Maximum Junction Temperature
An estimation of the device junction temperature, T
J, can be obtained from the equation:
TJ = TA + (RJA PD)
where:
TA = ambient temperature for the package (oC)
RJA = junction to ambient thermal resistance (oC/W)
PD = power dissipation in the package (W)
The thermal resistance values used are based on the JEDEC JESD51 series of standards to provide
consistent values for estimations and comparisons. The difference between the values determined for the
single-layer (1s) board compared to a four-layer board that has two signal layers, a power and a ground
plane (2s2p), demonstrate that the effective thermal resistance is not a constant. The thermal resistance
depends on the:
Construction of the application board (number of planes)
Effective size of the board which cools the component
Quality of the thermal and electrical connections to the planes
Power dissipated by adjacent components
Connect all the ground and power balls to the respective planes with one via per ball. Using fewer vias to
connect the package to the planes reduces the thermal performance. Thinner planes also reduce the thermal
performance. When the clearance between the vias leave the planes virtually disconnected, the thermal
performance is also greatly reduced.
As a general rule, the value obtained on a single-layer board is within the normal range for the tightly
packed printed circuit board. The value obtained on a board with the internal planes is usually within the
normal range if the application board has:
One oz. (35 micron nominal thickness) internal planes
Components are well separated
Overall power dissipation on the board is less than 0.02 W/cm2
The thermal performance of any component depends on the power dissipation of the surrounding
components. In addition, the ambient temperature varies widely within the application. For many natural
convection and especially closed box applications, the board temperature at the perimeter (edge) of the
package is approximately the same as the local air temperature near the device. Specifying the local
ambient conditions explicitly as the board temperature provides a more precise description of the local
ambient conditions that determine the temperature of the device.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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| MPC5554MVR112 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Microcontroller |
| MPC5554MVR132 | 功能描述:32位微控制器 - MCU MPC5554 COPPERHEAD Qorivva RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:90 MHz 程序存儲(chǔ)器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT |
| MPC5554MVR132R2 | 功能描述:32位微控制器 - MCU COPPERHEAD Qorivva RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:90 MHz 程序存儲(chǔ)器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT |
| MPC5554MVR80 | 制造商:Freescale Semiconductor 功能描述:MCU 32BIT 55XX RISC 2MB FLASH 1.8V/2.5V/3.3V/5V 416BGA - Trays |
| MPC5554MVR80R2 | 制造商:Freescale Semiconductor 功能描述:MCU 32BIT 55XX RISC 2MB FLASH 1.8V/2.5V/3.3V/5V 416BGA - Tape and Reel |
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