參數(shù)資料
型號(hào): MPC5554MZP132R2
廠商: Freescale Semiconductor
文件頁(yè)數(shù): 50/58頁(yè)
文件大?。?/td> 0K
描述: IC MCU 2M FLASH 132MHZ 416-PBGA
產(chǎn)品培訓(xùn)模塊: MPC55xx PitchPak Family
標(biāo)準(zhǔn)包裝: 500
系列: MPC55xx Qorivva
核心處理器: e200z6
芯體尺寸: 32-位
速度: 132MHz
連通性: CAN,EBI/EMI,SCI,SPI
外圍設(shè)備: DMA,POR,PWM,WDT
輸入/輸出數(shù): 256
程序存儲(chǔ)器容量: 2MB(2M x 8)
程序存儲(chǔ)器類型: 閃存
RAM 容量: 64K x 8
電壓 - 電源 (Vcc/Vdd): 1.35 V ~ 1.65 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 40x12b
振蕩器型: 外部
工作溫度: -40°C ~ 125°C
封裝/外殼: 416-BBGA
包裝: 帶卷 (TR)
配用: MPC5554INT-ND - BOARD DEMO MPC5554
MPC5554EVBISYS-ND - BOARD EVAL ISYSTEMS MPC5554
MPC5554EVBGHS-ND - BOARD EVAL GREEN HILLS SOFTWARE
MPC5554EVB-ND - BOARD EVALUATION MPC5554
MPC5534EVBISYS-ND - KIT EVAL ISYSTEMS MPC5534
MPC5534EVBGHS-ND - KIT EVAL GREEN HILLS SOFTWARE
MPC5534EVB-ND - KIT EVALUATION MPC5534MZP80
MPC5554EVBE-ND - BOARD EVAL FOR MPC5554
MPC5534EVBE-ND - BOARD EVAL FOR MPC5534
MPC5554 Microcontroller Data Sheet, Rev. 4
Revision History for the MPC5554 Data Sheet
Freescale Semiconductor
54
5
Revision History for the MPC5554 Data Sheet
The history of revisions made to this data sheet are described in this section.
5.1
Changes between Revision 3 and Revision 4
5.2
Changes between Revision 2 and Revision 3
The substantive changes incorporated in MPC5554 Data Sheet Rev. 2.0 to produce Rev. 3.0 are listed in
Table 28. The changes are listed in sequential page number order.
Location
Description of Changes
Added the following paragraph in Section 3.7, “Power-Up/Down Sequencing”:
“During initial power ramp-up, when Vstby is 0.6v or above. a typical current of 1-3mA and
maximum of 4mA may be seen until VDD is applied. This current will not reoccur until Vstby is
lowered below Vstby min. specification”.
Moved Figure 2 (fISTBY Worst-case Specifications) “ISTBY Worst-case Specifications” to
Removed the footnote “Figure 3 shows an illustration of the IDD_STBY values interpolated for
these temperature values”.
Changed the footnote attached to IDD_STBY” to “The current specification relates to average
standby operation after SRAM has been loaded with data. For power up current see
In Table 9 (DC Electrical Specifications (TA = TL to TH)) the Characteristic “Refer to Figure 3 for
an interpolation of this data” changed to “RAM standby current”.
Table 28. Changes Between Rev. 2.0 and 3.0
Location
Description of Changes
Throughout:
Changed ‘TA = TL – TH’ to ‘TA = TL to TH.’
Title page:
Changed the Revision number from 2 to 3. Changed the date. Made the same change in the lower left corner of the
back page.
Fourth paragraph, First sentence: Deleted ‘of the MPC5500 family’; Second to last sentence: Deleted ‘can’.
Fifth paragraph, First sentence: Replaced ‘MPC5500 family’ with ‘MPC5554’; Last sentence: Replaced ‘can be’
with ‘is’.
Sixth paragraph, First sentence: Replaced ‘MPC5500 family’ with ‘MPC5554’;
Second to last paragraph: Rewrote to read: The MCU has an on-chip enhanced queued dual analog-to-digital
converter (eQADC). The 416 package has 40-channels.
Updated the address of Semiconductor Equipment and Materials International
3081 Zanker Rd.
San Jose, CA., 95134
(408) 943-6900
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