參數(shù)資料
型號(hào): MPC5566MZP132
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, FLASH, 132 MHz, MICROCONTROLLER, PBGA416
封裝: 27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, BGA-416
文件頁(yè)數(shù): 60/66頁(yè)
文件大?。?/td> 1351K
代理商: MPC5566MZP132
Revision History for the MPC5566 Data Sheet
MPC5566 Microcontroller Data Sheet, Rev. 2.0
Freescale Semiconductor
63
5.2
Information Changed Between Revisions 1.0 and 2.0
The following table lists the information that changed in the tables between Rev. 1.0 and 2.0. Click the
links to see the change.
Table 27, EQADC SSI Timing Characteristics:
Deleted from table title ‘(Pads at 3.3 V or 5.0 V)’
Deleted 1st line in table ‘CLOAD = 25 pF on all outputs. Pad drive strength set to maximum.’
Spec 1: FCK frequency -- removed.
Combined footnotes 1 and 2, and moved the new footnote to Spec 2. Moved old footnote 3 that is now
footnote 2 to Spec 2.
Footnote 1, deleted ‘VDD = 1.35–1.65 V’ and ‘VDD33 and VDDSYN = 3.0–3.6 V.’
Changed ‘CL = 50 pF’ to ‘CL = 25 pF.’
Footnote 2: added ‘cycle’ after ‘duty’ to read: FCK duty cycle is not 50% when . . . .
Figure 32, MPC5566 416 Package: Deleted the version number and date.
Table 34. Table Changes Between Rev. 1.0 and 2.0
Location
Description of Changes
Table 3, MPC5566 Thermal Characteristics:
Changed for production purposes, footnote 1 from:
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
to:
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other board components, and board thermal
resistance.
Table 6, VCR/POR Electrical Specifications:
Added footnote 1 to specs 1, 2, and 3 that reads: On power up, assert RESET before VPOR15, VPOR33, and VPOR5
negate (internal POR). RESET must remain asserted until the power supplies are within the operating conditions
as specified in Table 9 DC Electrical Specifications. On power down, assert RESET before any power supplies fall
outside the operating conditions and until the internal POR asserts.
Table 9, DC Electrical Specifications:
Added footnote that reads: VDDE2 and VDDE3 are limited to 2.25–3.6 V only if EBTS = 0; VDDE2 and VDDE3 have
a range of 1.6–3.6 V if EBTS =1.
Removed footnote to specs 27a, b, and c on the max values that read: “Preliminary. Specification pending final
characterization.”
Removed footnote to specs 27a, b, and c on the max values that read: “Specification pending final
characterization.”
Table 16, Flash BIU Settings vs. Frequency of Operation:
Removed footnote 9 in columns APC and RWSC for 147 MHz row that read: Preliminary setting. Final setting
pending characterization.
Table 33. Table and Figure Changes Between Rev. 0.0 and Rev. 1.0 (continued)
Location
Description of Changes
Because
of
an
order
from
the
United
States
International
Trade
Commission,
BGA-packaged
product
lines
and
part
numbers
indicated
here
currently
are
not
available
from
Freescale
for
import
or
sale
in
the
United
States
prior
to
September
2010:
MPC551x
and
MPC5533
products
in
208
MAPBGA
packages;
MPC5534
and
MPC5553
products
in
208
and
496
MAPBGA
packages;
MPC5554,
MPC5565,
MPC5566
and
MPC5567
products
in
496
MAPBGA
packages
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