參數(shù)資料
型號: MPC603AFE80CC
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: RISC PROCESSOR, CQFP240
封裝: 32 X 32 MM, 3.10 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
文件頁數(shù): 13/31頁
文件大?。?/td> 120K
代理商: MPC603AFE80CC
20
603 Hardware Specifications
1.7.2.2 Mechanical Dimensions of the IBM C4-CQFP Package
Figure 11 shows the mechanical dimensions for the IBM C4-CQFP package.
Figure 11. Mechanical Dimensions of the IBM C4-CQFP Package
*Reduced pin count shown for clarity. 60 pins per side
min
max
A
31.8
32.2
B
34.4
34.8
C
2.33
2.93
D
0.45
0.55
E
0.18
0.28
F
0.585
0.685
G
0.12
0.20
H
0.40
0.60
Jmin
0.30
0.40
Ang
0.0
°
5.0
°
Rad
0.25
Clip Leadframe
Chip
Tape Cast Ceramic
Epoxy Dam
Urethane
Solder-Bump Encapsulant
H
Jmin
Radius
0.08
F
G
A
B
E
0.13 TOTAL
s
A-B
-C-
0.13 TOTAL
s
A-B
0.08 TOTAL M
A-B
D
-A-
Pin 240
Pin 1
* Not to scale
All measurements in mm
Ang
-B-
C
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