參數(shù)資料
型號(hào): MPC603EFE100LX
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 100 MHz, RISC PROCESSOR, CQFP240
封裝: 32 X 32 MM, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
文件頁數(shù): 15/32頁
文件大小: 149K
代理商: MPC603EFE100LX
22
PID6-603e Hardware Specifications, Rev 2
1.7.2 CBGA Package Description
The following sections provide the package parameters and mechanical dimensions for the CBGA package.
1.7.2.1 Package Parameters
The package parameters are as provided in the following list. The package type is 21 x 21 mm, 255-pin
ceramic ball grid array (CBGA).
Package outline
21 mm
Interconnects
255
Pitch
1.27 mm
Minimum module height
2.45 mm
Maximum module height
3.00 mm
Ball diameter
0.89 mm (35 mil)
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