參數(shù)資料
型號(hào)： MPC603RRX233LX
廠商： MOTOROLA INC
元件分類(lèi)： 微控制器/微處理器
英文描述： 32-BIT, 233 MHz, RISC PROCESSOR, CBGA255
封裝： 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255
文件頁(yè)數(shù)： 27/36頁(yè)
文件大?。?/td> 440K
代理商： MPC603RRX233LX
PID7t-603e Hardware Specifications
33
Ordering Information
design and its operating conditions. In addition to the component's power consumption, a number of factors
affect the nal operating die-junction temperatureairow, board population (local heat ux of adjacent
components), heat sink efciency, heat sink attach, heat sink placement, next-level interconnect technology,
system air temperature rise, altitude, etc.
Due to the complexity and the many variations of system-level boundary conditions for today's
microelectronic equipment, the combined effects of the heat transfer mechanisms (radiation, convection and
conduction) may vary widely. For these reasons, we recommend using conjugate heat transfer models for
the board, as well as, system-level designs. To expedite system-level thermal analysis, several compact
thermal-package models are available within FLOTHERM¨. These are available upon request.
1.9 Ordering Information
Figure 19 provides the part numbering nomenclature for the PID7t-603e. Note that the individual part
numbers correspond to a maximum processor core frequency. For available frequencies, contact your local
Motorola sales ofce.
In addition to the processor frequency, the part numbering scheme also consists of a part modier and
application modier. The part modier indicates any enhancement(s) in the part from the original design.
The application modier may specify special bus frequencies or application conditions. Each part number
also contains a revision code. This refers to the die mask revision number and is specied in the part
numbering scheme for identication purposes only.
Figure 19. Part Number Key
MPC 603 R RX XXX X X
Product Code
Part Identifier
Part Modifier
Application Modifier
(R = Remapped, Enhanced, Low-Voltage)
(L = Any Valid PLL Configuration)
Package
Processor Frequency
(Contact Motorola Sales Office)
Revision Level
(RX = CBGA without Lid)
(T = Extended Termperature Range)
(ZT = PBGA Package)
相關(guān)PDF資料
PDF描述
MPC603RRX100LX 32-BIT, 100 MHz, RISC PROCESSOR, CBGA255
MPC603RRX133LX 32-BIT, 133 MHz, RISC PROCESSOR, CBGA255
MPC603RZT300TA 32-BIT, 300 MHz, RISC PROCESSOR, PBGA255
MPC603RZT300LX 32-BIT, 300 MHz, RISC PROCESSOR, PBGA255
MPC603RRX166LX 32-BIT, 166 MHz, RISC PROCESSOR, CBGA255
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC603RRX266LC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RRX266TC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RRX300LC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RVG200LC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RVG300LC 功能描述:微處理器 - MPU 603R REV2.1 HIP3 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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