參數(shù)資料
型號(hào): MPC603RZT300TA
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 300 MHz, RISC PROCESSOR, PBGA255
封裝: 23 X 23 MM, 2.60 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-255
文件頁(yè)數(shù): 13/36頁(yè)
文件大小: 440K
代理商: MPC603RZT300TA
20
PID7t-603e Hardware Specifications
Package Descriptions
1.7.2 PBGA Package Description
The following sections provide the package parameters and mechanical dimensions for the PBGA package.
1.7.2.1 Package Parameters
The package parameters are as provided in the following list. The package type is 23 mm x 23 mm, 255-lead
plastic ball grid array (PBGA).
Package outline
23 mm x 23 mm
Interconnects
255
Pitch
1.27 mm (50 mil)
Package height
Minimum: 2.1 mm
Maximum: 2.6 mm
Ball diameter
0.76 mm (30 mil)
Maximum heat sink force
5 lbs
相關(guān)PDF資料
PDF描述
MPC603RZT300LX 32-BIT, 300 MHz, RISC PROCESSOR, PBGA255
MPC603RRX166LX 32-BIT, 166 MHz, RISC PROCESSOR, CBGA255
MPC603RZT266LX 32-BIT, 266 MHz, RISC PROCESSOR, PBGA255
MPC603RZT233TX 32-BIT, 233 MHz, RISC PROCESSOR, PBGA255
MPC604ERX200 32-BIT, 200 MHz, RISC PROCESSOR, CBGA256
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC604E 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:PowerPC 604e-TM RISC Microprocessor Technical Summary
MPC6071 制造商:International Rectifier 功能描述:
MPC616 制造商:Hammond Manufacturing 功能描述:6" X 16" MAGNET PANEL COVER
MPC-628-011B 制造商:FCI 功能描述:
MPC628726C 制造商:FCI 功能描述:- Bulk