- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄45352 > MPC740ARX266LX (FREESCALE SEMICONDUCTOR INC) 32-BIT, 266 MHz, RISC PROCESSOR, CBGA255 PDF資料下載
參數(shù)資料
| 型號(hào)： | MPC740ARX266LX |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 266 MHz, RISC PROCESSOR, CBGA255 |
| 封裝： | 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 |
| 文件頁數(shù)： | 36/44頁 |
| 文件大小： | 558K |
| 代理商： | MPC740ARX266LX |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁當(dāng)前第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁
MPC750A RISC Microprocessor Hardware Specications
41
System Design Information
Figure 23. Thermalloy #2328B Heat Sink-to-Ambient Thermal Resistance Versus Airflow Velocity
Assuming an air velocity of 0.5 m/s, we have an effective Rsa of 7 °C/W, thus
Tj = 30 °C + 5 °C + (2.2 °C/W +1.0 °C/W + 7 °C/W) * 4.5 W,
resulting in a die-junction temperature of approximately 81 °C which is well within the maximum
operating temperature of the component.
Other heat sinks offered by Chip Coolers, IERC, Thermalloy, Wakeeld Engineering, and Aavid
Engineering offer different heat sink-to-ambient thermal resistances, and may or may not need air ow.
Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances are a common
gure-of-merit used for comparing the thermal performance of various microelectronic packaging
technologies, one should exercise caution when only using this metric in determining thermal management
because no single parameter can adequately describe three-dimensional heat ow. The nal die-junction
operating temperature, is not only a function of the component-level thermal resistance, but the
system-level design and its operating conditions. In addition to the component's power consumption, a
number of factors affect the nal operating die-junction temperature—airow, board population (local heat
ux of adjacent components), heat sink efciency, heat sink attach, heat sink placement, next-level
interconnect technology, system air temperature rise, altitude, etc.
Due to the complexity and the many variations of system-level boundary conditions for today's
microelectronic equipment, the combined effects of the heat transfer mechanisms (radiation, convection
and conduction) may vary widely. For these reasons, we recommend using conjugate heat transfer models
for the board, as well as, system-level designs.
To expedite system-level thermal analysis, several
“compact” thermal-package models are available within FLOTHERM.
These are available upon
request.
1
3
5
7
8
0
0.5
1
1.5
2
2.5
3
3.5
Thermalloy #2328B Pin-fin Heat Sink
Approach Air Velocity (m/s)
Heat
Sink
Thermal
Resistance
(C/W)
(25 x28 x 15 mm)
2
4
6
F
re
e
sc
a
le
S
e
m
ic
o
n
d
u
c
to
r,
I
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
c
..
.
AR
CH
IVE
D B
Y F
RE
ES
CA
LE
SE
MI
CO
ND
UC
TO
R,
INC
.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MPC740ARX200LX | 32-BIT, 200 MHz, RISC PROCESSOR, CBGA255 |
| MPC750ARX266LX | 32-BIT, 266 MHz, RISC PROCESSOR, CBGA360 |
| MPC740ARX233TX | 32-BIT, 233 MHz, RISC PROCESSOR, CBGA255 |
| MPC740ARX266TX | 32-BIT, 266 MHz, RISC PROCESSOR, CBGA255 |
| MPC7410RX450LD | 32-BIT, 450 MHz, RISC PROCESSOR, CBGA360 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC7410 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:RISC Microprocessor Hardware Specifications Addendum |
| MPC7410_1 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:RISC Microprocessor Hardware Specifications |
| MPC7410_10 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:RISC Microprocessor Hardware Specifications Addendum |
| MPC74-103J | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Metal Plate Cement Resistors |
| MPC74-103K | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Metal Plate Cement Resistors |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。