參數(shù)資料
型號： MPC7410RX500LE
廠商： Freescale Semiconductor
文件頁數(shù)： 43/56頁
文件大?。?/td> 0K
描述： IC MPU 32BIT 500MHZ PPC 360-CBGA
標(biāo)準(zhǔn)包裝： 44
系列： MPC74xx
處理器類型： 32-位 MPC74xx PowerPC
速度： 500MHz
電壓： 1.8V
安裝類型： 表面貼裝
封裝/外殼： 360-BBGA，F(xiàn)CCBGA
供應(yīng)商設(shè)備封裝： 360-FCCBGA（25x25）
包裝： 托盤
MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1
48
Freescale Semiconductor
Document Revision History
9
Document Revision History
Table 16 provides a revision history for this hardware specification.
Table 16. Document Revision History
Revision
Date
Substantive Change(s)
6.1
11/16/2007 Updated Table 17 and Table 19 to show the VU package is available as an MC prefix device compared
to an MPC prefix for the other package types; this was done to match the specification documents
with the device ordering and part marking information.
Updated title of Table 19 to reflect correct name of referenced document and updated respective
document order information below table.
Updated notes in Table 1–Table 3 replacing references to MPC7410RX
nnnLE with Mxx7410xxnnnLE
since notes to apply to all the available packages types.
6
8/14/2007
Updated Table 4 thermal information:
Deleted rows on single-layer (1s) boards.
CBGA package RθJMA for natural convection for four layer boards changed from 17 to 18 °C/W.
HCTE package RθJMA for natural convection for four layer boards changed from 22 to 20 °C/W.
HCTE package RθJMA for 200 ft./min airflow for four layer boards changed from 19 to 16 °C/W with
airflow rate specification changed from 200 ft./min to 1 m/sec.
HCTE package RθJMA for 400 ft./min airflow for four layer boards changed from 18 to 15 °C/W with
airflow rate specification changed from 400 ft./min to 2 m/sec.
CBGA package RθJB changed from 8 to 9°C/W.
HCTE package RθJB changed from 14 to 11°C/W.
Table 4 Notes 2 - 4 have been revised and updated; Note 5 is no longer used. Notes on table rows
have been renumbered.
Updated Figure 26 removing optional heat sink clip to package.
Removed references in document to adhesive attached thermal solutions.
Updated thermal solution vendor information in Section 8.8.
Added HCTE_CBGA Lead Free C5 Spheres (VU) packaging information to document:
Added Figure 18 for HCTE_CBGA Lead Free C5 Spheres package, similar to Figure 17 but with
differences in dimensions A, A1, and b in the figure’s dimension table.
Added HCTE_CBGA Lead Free C5 Spheres (VU) packaging information in Table 17 and Table 19.
Changed part marking example in Figure 31 to an HCTE_CBGA device.
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