參數(shù)資料
型號(hào)： MPC7410THX450LE
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 450 MHz, RISC PROCESSOR, CBGA360
封裝： 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FCBGA-360
文件頁(yè)數(shù)： 3/73頁(yè)
文件大?。?/td> 929K
代理商： MPC7410THX450LE
MOTOROLA
MPC7410 RISC Microprocessor Hardware Specications
11
Electrical and Thermal Characteristics
Table 5 provides the DC electrical characteristics for the MPC7410.
Junction-to-ambient thermal resistance, 400 ft/min airow,
four-layer (2s2p) board
RθJMA
13
18
°C/W
Junction-to-board thermal resistance
RθJB
8
14
°C/W
4
Junction-to-case thermal resistance
RθJC
< 0.1
°C/W
5
Notes:
1. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airow, power dissipation of other components on the board, and board thermal
resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method
(MIL SPEC-883 Method 1012.1) with the calculated case temperature. The actual value of RθJC for the part is less
than 0.1C/W.
Note: Refer to Section 1.8.8, “Thermal Management Information,” for more details about thermal management.
Table 5. DC Electrical Specications
At recommended operating conditions (see Table 3)
Characteristic
Nominal
Bus
Voltage1
Symbol
Min
Max
Unit
Notes
Input high voltage (all inputs except
SYSCLK)
1.8
VIH
0.65
× (L2)OV
DD
(L2)OVDD + 0.2
V
2, 3, 8
2.5
VIH
1.7
(L2)OVDD + 0.2
3.3
VIH
2.0
OVDD + 0.3
Input low voltage (all inputs except
SYSCLK)
1.8
VIL
–0.3
0.35
× (L2)OV
DD
V8
2.5
VIL
–0.3
0.2
× (L2)OV
DD
3.3
VIL
–0.3
0.8
SYSCLK input high voltage
1.8
CVIH
1.5
OVDD + 0.2
V
2, 8
2.5
CVIH
2.0
OVDD + 0.2
3.3
CVIH
2.4
OVDD + 0.3
SYSCLK input low voltage
1.8
CVIL
–0.3
0.2
V
8
2.5
CVIL
–0.3
0.4
3.3
CVIL
–0.3
0.4
Table 4. Package Thermal Characteristics (continued)
Characteristic
Symbol
Value
Unit
Notes
MPC7410
CBGA
MPC7410
HCTE
CBGA
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參數(shù)描述
MPC7410THX450NE 功能描述:微處理器 - MPU NT NITCE RV1.4,1.8V -40C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC7410THX500LE 功能描述:微處理器 - MPU NT HITCE RV1.4 1.8V -40C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC7410TRX400NE 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:RISC Microprocessor Hardware Specifications Addendum
MPC7410TRX450NE 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:RISC Microprocessor Hardware Specifications Addendum
MPC7410VS400LE 功能描述:微處理器 - MPU NITRO R1.4 105C PB FREE RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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