參數(shù)資料
型號: MPC8245LZU300B
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 300 MHz, RISC PROCESSOR, PBGA352
封裝: 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, CAVITY-UP, TBGA-352
文件頁數(shù): 46/64頁
文件大?。?/td> 940K
代理商: MPC8245LZU300B
50
MPC8245 Integrated Processor Hardware Specifications
MOTOROLA
System Design Information
Figure 30. Die Junction-to-Ambient Resistance
The board designer can choose between several types of heat sinks to place on the MPC8245. There are
several commercially available heat sinks for the MPC8245 provided by the following vendors:
Aavid Thermalloy
603-224-9988
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech
408-749-7601
473 Sapena Ct. #15
Santa Clara, CA 95054
Internet: www.alphanovatech.com
International Electronic Research Corporation (IERC)
818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Tyco Electronics
800-522-6752
Chip Coolers
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
2
4
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18
00.5
1
1.5
22.5
D
ie
Ju
nct
ion
-to-Am
bi
ent
The
rma
lR
e
si
st
a
n
c
e
(°C
/W
)
Airflow Velocity (m/s)
No heat sink and high thermal board-level loading of
adjacent components
No heat sink and low thermal board-level loading of
adjacent components
Attached heat sink and high thermal board-level loading of
adjacent components
Attached heat sink and low thermal board-level loading of
adjacent components
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