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參數(shù)資料
| 型號： | MPC8260ACZU |
| 廠商： | Motorola, Inc. |
| 英文描述： | MPC826xA (HiP4) Family Hardware Specifications |
| 中文描述： | MPC826xA（HiP4）家庭硬件規(guī)格 |
| 文件頁數(shù)： | 45/48頁 |
| 文件大?。?/td> | 315K |
| 代理商： | MPC8260ACZU |
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MOTOROLA
MPC826xA (HiP4) Family Hardware Specifications
45
Ordering Information
1.6
Ordering Information
Figure 16 provides an example of the Motorola part numbering nomenclature for the MPC826xA. In
addition to the processor frequency, the part numbering scheme also consists of a part modifier that indicates
any enhancement(s) in the part from the original production design. Each part number also contains a
revision code that refers to the die mask revision number and is specified in the part numbering scheme for
identification purposes only. For more information, contact your local Motorola sales office.
Figure 16. Motorola Part Number Key
1.7
Document Revision History
Table 22 lists significant changes in each revision of this document.
Table 22. Document Revision History
Revision
Date
Substantive Changes
0
—
Initial version
0.1
8/2001
Table 8: Change to sp20/sp21.
0.2
11/2001
Revision of Table 5, “Power Dissipation”
Modifications to Figure 9, Table 2,Table 10, Table 11, and Table 17
Modification to pinout diagram, Figure 13
Additional revisions to text and figures throughout
0.3
11/2001
Table 1: note 3
Section 1.2.1: Removal of “Warning” recommending use of bootstrap diodes. They are not
needed.
Table 9: Change to sp12.
Table 10: Change to sp32.
Note 2 for Table 15 and Table 16
Addition of note at beginning of Section 1.3.2
Note 1 for Table 17 and Table 18
Table 19: Additions to B27, C28, D25, D27, E26, G29, H26–28, N25, P29, AF25, AA25, AB27
0.4
2/2002
Note 2 for Table 2 (changes in italics): “...greater than
or equal to
266
MHz,
200
MHz CPM...”
Table 18: Core and bus frequency values for the following ranges of MODCK_HMODCK:
0011_000 to 0011_100 and 1011_000 to 1011_1000
Table 19: Notes added to pins at AE11, AF25, U5, and V4.
Product Code
Device Number
Process Technology
(None = 0.29 micron
A = 0.25 micron)
Package
ZU = 480 TBGA
VR = 516 PBGA
Processor Frequency
(CPU/CPM/Bus)
Die Revision Level
MPC 826X A
C ZU XXX
X
Temperature Range
(Blank = 0 to 105 C
C = -40 to 105 C
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