參數(shù)資料
型號: MPC8270ZQSLDX
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 375 MHz, RISC PROCESSOR, PBGA516
封裝: 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-516
文件頁數(shù): 72/80頁
文件大小: 536K
代理商: MPC8270ZQSLDX
MPC8280 PowerQUICC II Family Hardware Specifications, Rev. 1.8
74
Freescale Semiconductor
Package Description
9.2 Mechanical Dimensions
Figure 17 provides the mechanical dimensions and bottom surface nomenclature of the 480 TBGA (ZU/VV)
package. Refer to Table 2.
Figure 17. Mechanical Dimensions and Bottom Surface Nomenclature—480 TBGA
Dim
Millimeters
Min
Max
A
1.45
1.65
A1
0.60
0.70
A2
0.85
0.95
A3
0.25
b
0.65
0.85
D
37.50 BSC
D1
35.56 REF
e
1.27 BSC
E
37.50 BSC
E1
35.56 REF
Notes:
1. Dimensions and Tolerancing per ASME
Y14.5M-1994.
2. Dimensions in millimeters.
3. Dimension b is measured at the
maximum solder ball diameter, parallel to
primary data A.
4. Primary data A and the seating plane are
defined by the spherical crowns of the
solder balls.
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