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參數(shù)資料
| 型號： | MPC8280CVVQLDA |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 4/83頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MPU POWERQUICC II 480-TBGA |
| 標準包裝： | 21 |
| 系列： | MPC82xx |
| 處理器類型： | 32-位 MPC82xx PowerQUICC II |
| 速度： | 333MHz |
| 電壓： | 1.5V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 480-LBGA |
| 供應商設備封裝： | 408-TBGA（37.5x37.5） |
| 包裝： | 托盤 |
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MPC8280 PowerQUICC II Family Hardware Specifications, Rev. 2
12
Freescale Semiconductor
Thermal Characteristics
4
Thermal Characteristics
This table describes thermal characteristics for both the packages. See Table 2 for information on a given
SoC’s package. Discussions of each characteristic are provided in Section 4.1, “Estimation with
Junction-to-Ambient Thermal Resistance,” and Section 4.5, “Experimental Determination.” For the these
discussions, PD =(VDD × IDD) + PI/O, where PI/O is the power dissipation of the I/O drivers.
4.1
Estimation with Junction-to-Ambient Thermal Resistance
An estimation of the chip junction temperature, T
J, in
C can be obtained from the following equation:
TJ = TA + (RθJA × PD)
where:
TA = ambient temperature (C)
RθJA = package junction-to-ambient thermal resistance (C/W)
PD = power dissipation in package
The junction-to-ambient thermal resistance is an industry standard value that provides a quick and easy
estimation of thermal performance. However, the answer is only an estimate; test cases have demonstrated
that errors of a factor of two (in the quantity TJ – TA) are possible.
4 V
IL for IIC interface does not match IIC standard, but does meet IIC standard for VOL and should not cause any compatibility
issue.
5 MPC8280, MPC8275VR, MPC8275ZQ only.
Table 6. Thermal Characteristics
Characteristic
Symbol
Value
Unit
Air Flow
480 TBGA
516 PBGA
Junction to ambient—
single-layer board1
1 Assumes no thermal vias
RθJA
16
27
°C/W
Natural convection
11
21
1 m/s
Junction to ambient—
four-layer board
RθJA
12
19
°C/W
Natural convection
916
1 m/s
Junction to board2
2 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
RθJB
611
°C/W
—
Junction to case3
3 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
RθJC
28
°C/W
—
Junction-to-package top4
4 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
Ψ
JT
22
°C/W
—
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| MPC8280CVVUPE | 制造商:Freescale Semiconductor 功能描述: |
| MPC8280CVVUPEA | 功能描述:微處理器 - MPU 450 MHz 885 MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8280CVVUPEA | 制造商:Freescale Semiconductor 功能描述:IC 32BIT MPU 450MHZ TBGA-480 |
| MPC8280CZQB | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications |
| MPC8280CZQE | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications |
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