參數(shù)資料
型號(hào): MPC8280CVVUPEA
廠商: Freescale Semiconductor
文件頁(yè)數(shù): 73/83頁(yè)
文件大小: 0K
描述: IC MPU POWERQUICC II 480-TBGA
標(biāo)準(zhǔn)包裝: 21
系列: MPC82xx
處理器類(lèi)型: 32-位 MPC82xx PowerQUICC II
速度: 450MHz
電壓: 1.5V
安裝類(lèi)型: 表面貼裝
封裝/外殼: 480-LBGA
供應(yīng)商設(shè)備封裝: 408-TBGA(37.5x37.5)
包裝: 托盤(pán)
MPC8280 PowerQUICC II Family Hardware Specifications, Rev. 2
Freescale Semiconductor
75
Package Description
9
Package Description
This figure shows the side profile of the TBGA package to indicate the direction of the top surface view.
Figure 15. Side View of the TBGA Package
This figure shows the side profile of the PBGA package to indicate the direction of the top surface view.
Figure 16. Side View of the PBGA Package Remove
3 Must be pulled down or left floating.
4 If PCI is not desired, must be pulled up or left floating.
5 Sphere is not connected to die.
6 GNDSYN (B18): This pin exists as a separate ground signal in MPC826x(A) devices; it does not exist as a separate ground
signal on the MPC8275/MPC8270. New designs must connect B18 to GND and follow the suggestions in Section 4.6, “Layout
Practices.” Old designs in which the MPC8275/MPC8270 is used as a drop-in replacement can leave the pin connected to
GND with the noise filtering capacitors.
7 XFC (A18) pin: This pin is used in MPC826x(A) devices; it is not used in MPC8275/MPC8270 because there is no need for
external capacitor to operate the PLL. New designs should connect A18 (XFC) pin to GND. Old designs in which the
MPC8275/MPC8270 is used as a drop-in replacement can leave the pin connected to the current capacitor.
Soldermask
Copper Traces
Die
Copper Heat Spreader
(Oxidized for Insulation)
1.27 mm Pitch
Glob-Top Dam
Wire Bonds
Etched
Pressure Sensitive
Die
Glob-Top Filled Area
Polymide Tape
Cavity
Adhesive
Attach
View
Die
Transfer molding compound
1 mm pitch
Wire bonds
attach
DIE
Ball bond
Screen-printed
solder mask
Cu substrate traces
Resin glass epoxy
Plated substrate via
相關(guān)PDF資料
PDF描述
2-84984-0 CONN FFC 20POS 1.00MM VERT PCB
MPC8540VT833LC MPU POWERQUICC III 783FCPBGA
1-84533-6 CONN FFC 16POS 1.25MM R/A PCB
MPC8260AZUPJDB IC MPU POWERQUICC II 480-TBGA
2-1734248-9 CONN FPC/ZIP 29POS 1MM VERT SMD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8280CVVUPEA 制造商:Freescale Semiconductor 功能描述:IC 32BIT MPU 450MHZ TBGA-480
MPC8280CZQB 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications
MPC8280CZQE 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications
MPC8280CZQI 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications
MPC8280CZQM 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications