參數(shù)資料
型號(hào): MPC8314CVRADDA
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: MICROPROCESSOR, PBGA620
封裝: 29 X 29 MM, LEAD FREE, PLASTIC, TEPBGA-620
文件頁(yè)數(shù): 74/106頁(yè)
文件大小: 1253K
代理商: MPC8314CVRADDA
MPC8314E PowerQUICC II Pro Processor Hardware Specifications, Rev. 0
Freescale Semiconductor
7
Electrical Characteristics
Misaligned transfer capability for source/destination address
Supports external DREQ, DACK and DONE signals
There is one I2C controller. This synchronous, multi-master buses can be connected to additional devices
for expansion and system development.
The DUART supports full-duplex operation and is compatible with the PC16450 and PC16550
programming models. 16-byte FIFOs are supported for both the transmitter and the receiver.
The enhanced local bus controller (eLBC) port allows connections with a wide variety of external DSPs
and ASICs. Three separate state machines share the same external pins and can be programmed separately
to access different types of devices. The general-purpose chip select machine (GPCM) controls accesses
to asynchronous devices using a simple handshake protocol. The three user programmable machines
(UPMs) can be programmed to interface to synchronous devices or custom ASIC interfaces. Each chip
select can be configured so that the associated chip interface can be controlled by the GPCM or UPM
controller. Both may exist in the same system. The local bus can operate at up to 66 MHz.
The system timers include the following features: periodic interrupt timer, real time clock, software
watchdog timer, and two general-purpose timer blocks.
3
Electrical Characteristics
This section provides the AC and DC electrical specifications and thermal characteristics for the
MPC8314E, which is currently targeted to these specifications. Some of these specifications are
independent of the I/O cell, but they are included for complete reference. These are not purely I/O buffer
design specifications.
3.1
Overall DC Electrical Characteristics
This section covers the ratings, conditions, and other characteristics.
3.1.1
Absolute Maximum Ratings
Table 1 provides the absolute maximum ratings.
Table 1. Absolute Maximum Ratings 1
Characteristic
Symbol
Max Value
Unit
Notes
Core supply voltage
VDD
–0.3 to 1.26
V
PLL supply voltage
AVDD
–0.3 to 1.26
V
DDR1 DRAM I/O supply voltage
GVDD
–0.3 to 2.7
V
DDR2 DRAM I/O supply voltage
GVDD
–0.3 to 1.9
V
PCI, local bus, DUART, system control and power
management, I2C, Ethernet management, 1588 timer and
JTAG I/O voltage
NVDD
–0.3 to 3.6
V
7
USB, and eTSEC I/O voltage
LVDD
–0.3 to 2.75 or
–0.3 to 3.6
V6, 8
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8314CVRAFDA 功能描述:微處理器 - MPU NON-ENCRYPT RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8314CVRAGDA 功能描述:微處理器 - MPU NON-ENCRYPT RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8314ECVRADDA 功能描述:微處理器 - MPU ENCRYPT RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8314ECVRAFDA 功能描述:微處理器 - MPU ENCRYPT RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8314ECVRAGDA 功能描述:微處理器 - MPU ENCRYPT RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324