參數(shù)資料
型號: MPC8315EVRAFDA
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 333 MHz, MICROPROCESSOR, PBGA620
封裝: 29 X 29 MM, 2.23 MM HEIGHT, 1 MM PITCH, LEAD FREE, TEPBGAII-620
文件頁數(shù): 5/112頁
文件大?。?/td> 1283K
代理商: MPC8315EVRAFDA
MPC8315E PowerQUICC II Pro Processor Hardware Specifications, Rev. 0
102
Freescale Semiconductor
Thermal (Preliminary)
25.2
Thermal Management Information
For the following sections, PD = (VDD × IDD) + PI/O where PI/O is the power dissipation of the I/O drivers.
25.2.1
Estimation of Junction Temperature with Junction-to-Ambient
Thermal Resistance
An estimation of the chip junction temperature, TJ, can be obtained from the equation:
TJ = TA + (RθJA × PD)
where:
TJ = junction temperature (°C)
TA = ambient temperature for the package (°C)
RθJA = junction to ambient thermal resistance (°C/W)
PD = power dissipation in the package (W)
The junction to ambient thermal resistance is an industry standard value that provides a quick and easy
estimation of thermal performance. As a general statement, the value obtained on a single layer board is
appropriate for a tightly packed printed circuit board. The value obtained on the board with the internal
planes is usually appropriate if the board has low power dissipation and the components are well separated.
Test cases have demonstrated that errors of a factor of two (in the quantity TJ - TA) are possible.
25.2.2
Estimation of Junction Temperature with Junction-to-Board
Thermal Resistance
The thermal performance of a device cannot be adequately predicted from the junction to ambient thermal
resistance. The thermal performance of any component is strongly dependent on the power dissipation of
surrounding components. In addition, the ambient temperature varies widely within the application. For
many natural convection and especially closed box applications, the board temperature at the perimeter
(edge) of the package is approximately the same as the local air temperature near the device. Specifying
the local ambient conditions explicitly as the board temperature provides a more precise description of the
local ambient conditions that determine the temperature of the device.
At a known board temperature, the junction temperature is estimated using the following equation:
TJ = TB + (RθJB × PD)
where:
TJ = junction temperature (°C)
TB = board temperature at the package perimeter (°C)
RθJB = junction to board thermal resistance (°C/W) per JESD51-8
PD = power dissipation in the package (W)
When the heat loss from the package case to the air can be ignored, acceptable predictions of junction
temperature can be made. The application board should be similar to the thermal test condition: the
component is soldered to a board with internal planes.
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MPC8315VRADD 制造商:Freescale Semiconductor 功能描述:MPC8315VRADD - Bulk
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