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參數(shù)資料
| 型號： | MPC8323ZQADDC |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 73/82頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MPU PWRQUICC II 516-PBGA |
| 產(chǎn)品培訓模塊： | MPC8323E PowerQUICC II Pro Processor |
| 標準包裝： | 40 |
| 系列： | MPC83xx |
| 處理器類型： | 32-位 MPC83xx PowerQUICC II Pro |
| 速度： | 266MHz |
| 電壓： | 1V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 516-BBGA |
| 供應(yīng)商設(shè)備封裝： | 516-FPBGA（27x27） |
| 包裝： | 托盤 |
| 配用： | MPC8323E-RDB-ND - BOARD REFERENCE DESIGN |
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MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4
Freescale Semiconductor
75
Thermal
Wakefield Engineering
603-635-5102
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
Interface material vendors include the following:
Chomerics, Inc.
781-935-4850
77 Dragon Ct.
Woburn, MA 01801
Internet: www.chomerics.com
Dow-Corning Corporation
800-248-2481
Dow-Corning Electronic Materials
P.O. Box 994
Midland, MI 48686-0997
Internet: www.dowcorning.com
Shin-Etsu MicroSi, Inc.
888-642-7674
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
The Bergquist Company
800-347-4572
18930 West 78th St.
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
23.3
Heat Sink Attachment
When attaching heat sinks to these devices, an interface material is required. The best method is to use
thermal grease and a spring clip. The spring clip should connect to the printed-circuit board, either to the
board itself, to hooks soldered to the board, or to a plastic stiffener. Avoid attachment forces which would
lift the edge of the package or peel the package from the board. Such peeling forces reduce the solder joint
lifetime of the package. Recommended maximum force on the top of the package is 10 lb (4.5 kg) force.
If an adhesive attachment is planned, the adhesive should be intended for attachment to painted or plastic
surfaces and its performance verified under the application requirements.
23.3.1
Experimental Determination of the Junction Temperature with a
Heat Sink
When heat sink is used, the junction temperature is determined from a thermocouple inserted at the
interface between the case of the package and the interface material. A clearance slot or hole is normally
required in the heat sink. Minimizing the size of the clearance is important to minimize the change in
thermal performance caused by removing part of the thermal interface to the heat sink. Because of the
experimental difficulties with this technique, many engineers measure the heat sink temperature and then
back calculate the case temperature using a separate measurement of the thermal resistance of the
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| MPC8323ZQADDCA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Integrated Communications Processor Family Hardware Specifications |
| MPC8323ZQAFDC | 功能描述:微處理器 - MPU 8323 PBGA W/O ENCR RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC8323ZQAFDCA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Integrated Communications Processor Family Hardware Specifications |
| MPC832XE-MDS-PB | 功能描述:開發(fā)板和工具包 - 其他處理器 PROCESSOR BOARD (SOCKET) RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓: |
| MPC8343CVRADD | 功能描述:IC MPU PWRQUICC II PRO 620-PBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC83xx 標準包裝:1 系列:MPC85xx 處理器類型:32-位 MPC85xx PowerQUICC III 特點:- 速度:1.2GHz 電壓:1.1V 安裝類型:表面貼裝 封裝/外殼:783-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:783-FCPBGA（29x29） 包裝:托盤 |
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