參數(shù)資料
型號： MPC8343CZQADDX
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 266 MHz, MICROPROCESSOR, PBGA620
封裝： 29 X 29 MM, 2.46 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-620
文件頁數(shù)： 73/92頁
文件大?。?/td> 987K
代理商： MPC8343CZQADDX
MPC8343E PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 6
Freescale Semiconductor
75
Thermal
19 Thermal
This section describes the thermal specifications of the MPC8343E.
19.1
Thermal Characteristics
.Table 52 provides the package thermal characteristics for the 620 29x29 mm PBGA of the MPC8343E
19.2
Thermal Management Information
For the following sections, PD = (VDD X IDD) + PI/O where PI/O is the power dissipation of the I/O drivers.
Table 52. Package Thermal Characteristics for PBGA
Characteristic
Symbol
Value
Unit
Notes
Junction-to-ambient Natural Convection on single layer board (1s)
RθJA
21
°C/W
1, 2
Junction-to-ambient Natural Convection on four layer board (2s2p)
RθJMA
15
°C/W
1, 3
Junction-to-ambient (@200 ft/min) on single layer board (1s)
RθJMA
17
°C/W
1, 3
Junction-to-ambient (@ 200 ft/min) on four layer board (2s2p)
RθJMA
12
°C/W
1, 3
Junction-to-board thermal
RθJB
6°C/W
4
Junction-to-case thermal
RθJC
5°C/W
5
Junction-to-Package Natural Convection on Top
ψ
JT
5°C/W
6
Notes
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
6. Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter
is written as Psi-JT.
相關(guān)PDF資料
PDF描述
MPC8343CVRADDX 32-BIT, 266 MHz, MICROPROCESSOR, PBGA620
MPC8343ZQAGDX 32-BIT, 400 MHz, MICROPROCESSOR, PBGA620
MPC8343EZQAGDX 32-BIT, 400 MHz, MICROPROCESSOR, PBGA620
MPC8343ECVRADDX 32-BIT, 266 MHz, MICROPROCESSOR, PBGA620
MPC8343CVRAGDX 32-BIT, 400 MHz, MICROPROCESSOR, PBGA620
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參數(shù)描述
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MPC8343CZQAGDB 功能描述:微處理器 - MPU 8347 PBGA W/O ENC W/ PB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8343EA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications
MPC8343ECVRADDB 功能描述:微處理器 - MPU 8347 PBGA NO-PB W/ ENC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8343ECVRAGD 功能描述:IC MPU PWRQUICC II PRO 620-PBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC83xx 標(biāo)準(zhǔn)包裝:1 系列:MPC85xx 處理器類型:32-位 MPC85xx PowerQUICC III 特點:- 速度:1.2GHz 電壓:1.1V 安裝類型:表面貼裝 封裝/外殼:783-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:783-FCPBGA（29x29） 包裝:托盤
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