參數(shù)資料
型號: MPC8343CZQAGD
廠商: Freescale Semiconductor
文件頁數(shù): 67/80頁
文件大小: 0K
描述: IC MPU PWRQUICC II PRO 620-PBGA
標(biāo)準(zhǔn)包裝: 36
系列: MPC83xx
處理器類型: 32-位 MPC83xx PowerQUICC II Pro
速度: 400MHz
電壓: 1.2V
安裝類型: 表面貼裝
封裝/外殼: 620-BBGA 裸露焊盤
供應(yīng)商設(shè)備封裝: 620-PBGA(29x29)
包裝: 托盤
MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 11
Freescale Semiconductor
7
Electrical Characteristics
2.1.2
Power Supply Voltage Specification
Table 2 provides the recommended operating conditions for the MPC8343EA. Note that the values in
Table 2 are the recommended and tested operating conditions. Proper device operation outside these
conditions is not guaranteed.
Input voltage
DDR DRAM signals
MVIN
–0.3 to (GVDD + 0.3)
V
2, 5
DDR DRAM reference
MVREF
–0.3 to (GVDD + 0.3)
V
2, 5
Three-speed Ethernet signals
LVIN
–0.3 to (LVDD + 0.3)
V
4, 5
Local bus, DUART, CLKIN, system control and
power management, I2C, and JTAG signals
OVIN
–0.3 to (OVDD + 0.3)
V
3, 5
PCI
OVIN
–0.3 to (OVDD + 0.3)
V
6
Storage temperature range
TSTG
–55 to 150
°C—
Notes:
1 Functional and tested operating conditions are given in Table 2. Absolute maximum ratings are stress ratings only, and
functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability or cause
permanent damage to the device.
2 Caution: MV
IN must not exceed GVDD by more than 0.3 V. This limit can be exceeded for a maximum of 20 ms during
power-on reset and power-down sequences.
3 Caution: OV
IN must not exceed OVDD by more than 0.3 V. This limit can be exceeded for a maximum of 20 ms during
power-on reset and power-down sequences.
4 Caution: LV
IN must not exceed LVDD by more than 0.3 V. This limit can be exceeded for a maximum of 20 ms during power-on
reset and power-down sequences.
5 (M,L,O)V
IN and MVREF may overshoot/undershoot to a voltage and for a maximum duration as shown in Figure 2.
6 OVIN on the PCI interface can overshoot/undershoot according to the PCI Electrical Specification for 3.3-V operation, as
shown in Figure 3.
Table 2. Recommended Operating Conditions
Parameter
Symbol
Recommended
Value
Unit
Notes
Core supply voltage
VDD
1.2 V ± 60 mV
V
1
PLL supply voltage
AVDD
1.2 V ± 60 mV
V
1
DDR and DDR2 DRAM I/O voltage
GVDD
2.5 V ± 125 mV
1.8 V ± 90 mV
V—
Three-speed Ethernet I/O supply voltage
LVDD1
3.3 V ± 330 mV
2.5 V ± 125 mV
V—
Three-speed Ethernet I/O supply voltage
LVDD2
3.3 V ± 330 mV
2.5 V ± 125 mV
V—
Table 1. Absolute Maximum Ratings1 (continued)
Parameter
Symbol
Max Value
Unit
Notes
相關(guān)PDF資料
PDF描述
IDT70V7599S166BCI8 IC SRAM 4MBIT 166MHZ 256BGA
MPC8343CZQADD IC MPU PWRQUICC II PRO 620-PBGA
0522712869 CONN FFC 28POS 1MM R/A SMD ZIF
10051922-2410ELF CONN FPC 24POS .5MM R/A SMD GOLD
AMC60DTES CONN EDGECARD 120POS .100 EYELET
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8343CZQAGDB 功能描述:微處理器 - MPU 8347 PBGA W/O ENC W/ PB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8343EA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications
MPC8343ECVRADDB 功能描述:微處理器 - MPU 8347 PBGA NO-PB W/ ENC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8343ECVRAGD 功能描述:IC MPU PWRQUICC II PRO 620-PBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC83xx 標(biāo)準(zhǔn)包裝:1 系列:MPC85xx 處理器類型:32-位 MPC85xx PowerQUICC III 特點:- 速度:1.2GHz 電壓:1.1V 安裝類型:表面貼裝 封裝/外殼:783-BBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:783-FCPBGA(29x29) 包裝:托盤
MPC8343ECVRAGDB 功能描述:微處理器 - MPU 8347 PBGA NO-PB W/ ENC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324