
MPC8347E PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 11
58
Freescale Semiconductor
Package and Pin Listings
18.4
Mechanical Dimensions for the MPC8347E PBGA
Figure 40 shows the mechanical dimensions and bottom surface nomenclature for the MPC8347E,
620-PBGA package.
Notes:
1.All dimensions are in millimeters.
2.Dimensioning and tolerancing per ASME Y14. 5M-1994.
3.Maximum solder ball diameter measured parallel to datum A.
4.Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
Figure 40. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC8347E PBGA