參數資料
型號: MPC8358ECVRAGDGA
廠商: Freescale Semiconductor
文件頁數: 86/95頁
文件大?。?/td> 0K
描述: MPU POWERQUICC II PRO 668-PBGA
標準包裝: 36
系列: MPC83xx
處理器類型: 32-位 MPC83xx PowerQUICC II Pro
速度: 400MHz
電壓: 1.2V
安裝類型: 表面貼裝
封裝/外殼: 668-BBGA 裸露焊盤
供應商設備封裝: 668-PBGA-PGE(29x29)
包裝: 托盤
MPC8358E PowerQUICC II Pro Processor Revision 2.1 PBGA Silicon Hardware Specifications, Rev. 3
Freescale Semiconductor
87
Thermal
Table 76 shows heat sinks and junction-to-ambient thermal resistance for PBGA package.
Accurate thermal design requires thermal modeling of the application environment using computational
fluid dynamics software which can model both the conduction cooling and the convection cooling of the
air moving through the application. Simplified thermal models of the packages can be assembled using the
junction-to-case and junction-to-board thermal resistances listed in the thermal resistance table. More
detailed thermal models can be made available on request.
Heat sink vendors include the following:
Aavid Thermalloy
603-224-9988
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech
408-749-7601
473 Sapena Ct. #15
Santa Clara, CA 95054
Internet: www.alphanovatech.com
International Electronic Research Corporation (IERC)
818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Table 76. Heat Sinks and Junction-to-Ambient Thermal Resistance of PBGA Package
Heat Sink Assuming Thermal Grease
Air Flow
29
× 29 mm PBGA
Thermal Resistance
AAVID 30
× 30 × 9.4 mm Pin Fin
Natural Convection
12.6
AAVID 30
× 30 × 9.4 mm Pin Fin
1 m/s
8.2
AAVID 30
× 30 × 9.4 mm Pin Fin
2 m/s
7.0
AAVID 31
× 35 × 23 mm Pin Fin
Natural Convection
10.5
AAVID 31
× 35 × 23 mm Pin Fin
1 m/s
6.6
AAVID 31
× 35 × 23 mm Pin Fin
2 m/s
6.1
Wakefield, 53
× 53 × 25 mm Pin Fin
Natural Convection
9.0
Wakefield, 53
× 53 × 25 mm Pin Fin
1 m/s
5.6
Wakefield, 53
× 53 × 25 mm Pin Fin
2 m/s
5.1
MEI, 75
× 85 × 12 no adjacent board, extrusion
Natural Convection
9.0
MEI, 75
× 85 × 12 no adjacent board, extrusion
1 m/s
5.7
MEI, 75
× 85 × 12 no adjacent board, extrusion
2 m/s
5.1
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