參數(shù)資料
型號(hào)： MPC8360ECZUALDGA
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 667 MHz, RISC PROCESSOR, PBGA740
封裝： 37.50 X 37.50 MM, 1.46 MM HEIGHT, 1 MM PITCH, TBGA-740
文件頁(yè)數(shù)： 98/102頁(yè)
文件大?。?/td> 606K
代理商： MPC8360ECZUALDGA
MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 5
Freescale Semiconductor
95
Heat Sink Attachment
Millennium Electronics (MEI)
408-436-8770
Loroco Sites
671 East Brokaw Road
San Jose, CA 95112
Internet: www.mei-millennium.com
Tyco Electronics
800-522-6752
Chip Coolers
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
Wakefield Engineering
603-635-5102
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
Interface material vendors include the following:
Chomerics, Inc.
781-935-4850
77 Dragon Ct.
Woburn, MA 01888-4014
Internet: www.chomerics.com
Dow-Corning Corporation
800-248-2481
Dow-Corning Electronic Materials
2200 W. Salzburg Rd.
Midland, MI 48686-0997
Internet: www.dowcorning.com
Shin-Etsu MicroSi, Inc.
888-642-7674
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
The Bergquist Company
800-347-4572
18930 West 78th St.
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
22.3
Heat Sink Attachment
When attaching heat sinks to these devices, an interface material is required. The best method is to use thermal grease and a
spring clip. The spring clip should connect to the printed-circuit board, either to the board itself, to hooks soldered to the board,
or to a plastic stiffener. Avoid attachment forces which would lift the edge of the package or peel the package from the board.
Such peeling forces reduce the solder joint lifetime of the package. Recommended maximum force on the top of the package is
10 lb force (4.5 kg force). If an adhesive attachment is planned, the adhesive should be intended for attachment to painted or
plastic surfaces and its performance verified under the application requirements.
相關(guān)PDF資料
PDF描述
MPC8360EVVAHFG 32-BIT, 500 MHz, RISC PROCESSOR, PBGA740
MPC8358CVVADDEA 32-BIT, 266 MHz, RISC PROCESSOR, PBGA740
MPC8358VVAGDEA 32-BIT, 400 MHz, RISC PROCESSOR, PBGA740
MPC8360VVAGFHA 32-BIT, 400 MHz, RISC PROCESSOR, PBGA740
MPC8360CVVAJFHA 32-BIT, 533 MHz, RISC PROCESSOR, PBGA740
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8360ECZUALDHA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360ECZUALFGA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360ECZUALFHA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360E-MDS-PBE 功能描述:開發(fā)板和工具包 - 其他處理器 SYSTEM BOARD FOR THE FRE RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評(píng)估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓:
MPC8360E-RDK 功能描述:開發(fā)板和工具包 - 其他處理器 GP REF DESGN BRD FOR MPC RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評(píng)估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓:
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