參數(shù)資料
型號: MPC8360ZUADDH
廠商: Freescale Semiconductor
文件頁數(shù): 24/102頁
文件大小: 0K
描述: IC MPU PWRQUICC II 740-TBGA
標準包裝: 21
系列: MPC83xx
處理器類型: 32-位 MPC83xx PowerQUICC II Pro
速度: 266MHz
電壓: 1.2V
安裝類型: 表面貼裝
封裝/外殼: 740-LBGA
供應商設備封裝: 740-TBGA(37.5x37.5)
包裝: 托盤
配用: MPC8360EA-MDS-PB-ND - KIT APPLICATION DEV 8360 SYSTEM
MPC8360E-RDK-ND - BOARD REFERENCE DESIGN FOR MPC
MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 5
28
Freescale Semiconductor
GMII, MII, RMII, TBI, RGMII, and RTBI AC Timing Specifications
8.2.1.2
GMII Receive AC Timing Specifications
This table provides the GMII receive AC timing specifications.
This figure shows the GMII receive AC timing diagram.
Figure 11. GMII Receive AC Timing Diagram
Table 28. GMII Receive AC Timing Specifications
At recommended operating conditions with LVDD/OVDD of 3.3 V ± 10%.
Parameter/Condition
Symbol1
Min
Typ
Max
Unit
Notes
RX_CLK clock period
tGRX
—8.0
ns
RX_CLK duty cycle
tGRXH/tGRX
40
60
%
RXD[7:0], RX_DV, RX_ER setup time to RX_CLK
tGRDVKH
2.0
ns
RXD[7:0], RX_DV, RX_ER hold time to RX_CLK
tGRDXKH
0.2
ns
RX_CLK clock rise time, (20% to 80%)
tGRXR
——
1.0
ns
RX_CLK clock fall time, (80% to 20%)
tGRXF
——
1.0
ns
Notes:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tGRDVKH symbolizes GMII
receive timing (GR) with respect to the time data input signals (D) reaching the valid state (V) relative to the tRX clock
reference (K) going to the high state (H) or setup time. Also, tGRDXKL symbolizes GMII receive timing (GR) with respect to
the time data input signals (D) went invalid (X) relative to the tGRX clock reference (K) going to the low (L) state or hold time.
Note that, in general, the clock reference symbol representation is based on three letters representing the clock of a
particular functional. For example, the subscript of tGRX represents the GMII (G) receive (RX) clock. For rise and fall times,
the latter convention is used with the appropriate letter: R (rise) or F (fall).
2. In rev. 2.0 silicon, due to errata, tGRDXKH minimum is 0.5 which is not compliant with the standard. Refer to Errata
QE_ENET18 in Chip Errata for the MPC8360E, Rev. 1.
RX_CLK
RXD[7:0]
tGRDXKH
tGRX
tGRXH
tGRXR
tGRXF
tGRDVKH
RX_DV
RX_ER
相關PDF資料
PDF描述
IDT70V5378S100BC8 IC SRAM 576KBIT 100MHZ 256BGA
MPC8545EVUANG IC MPU PWRQUICC III 783-FCCBGA
MPC8545EVUAQG IC MPU PWRQUICC III 783-FCCBGA
MPC8547EVUAUJ IC MPU PWRQUICC III 783-FCCBGA
MPC8548EHXAQG IC MPU PWRQUICC III 783-FCCBGA
相關代理商/技術參數(shù)
參數(shù)描述
MPC8360ZUAGDG 功能描述:微處理器 - MPU 8360 TBGA NON-ENCRP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8360ZUAGDGA 功能描述:微處理器 - MPU 8360 TBGA NON-ENCRP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8360ZUAGDHA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360ZUAGFGA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360ZUAGFHA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications