參數(shù)資料
型號: MPC8379VRAGD
廠商: Freescale Semiconductor
文件頁數(shù): 35/117頁
文件大小: 0K
描述: MPU POWERQUICC II PRO 689-PBGA
標(biāo)準(zhǔn)包裝: 27
系列: MPC83xx
處理器類型: 32-位 MPC83xx PowerQUICC II Pro
速度: 400MHz
電壓: 1V
安裝類型: 表面貼裝
封裝/外殼: 689-BBGA 裸露焊盤
供應(yīng)商設(shè)備封裝: 689-TEPBGA II(31x31)
包裝: 托盤
MPC8379E PowerQUICC II Pro Processor Hardware Specifications, Rev. 8
24
Freescale Semiconductor
8.2
MII, RGMII, RMII, and RTBI AC Timing Specifications
The AC timing specifications for MII, RGMII, RMII, and RTBI are presented in this section.
8.2.1
MII AC Timing Specifications
This section describes the MII transmit and receive AC timing specifications.
8.2.1.1
MII Transmit AC Timing Specifications
This table provides the MII transmit AC timing specifications.
Table 25. RGMII and RTBI DC Electrical Characteristics
Parameter
Symbol
Min
Max
Unit
Note
Supply voltage 2.5 V
LVDD1
LVDD2
2.37
2.63
V
Output high voltage
(LVDD1/LVDD2 = Min, IOH = –1.0 mA)
VOH
2.00
LVDD1/LVDD2 + 0.3
V
Output low voltage
(LVDD1/LVDD2 = Min, IOL = 1.0 mA)
VOL
GND – 0.3
0.40
V
Input high voltage
VIH
1.7
LVDD1/LVDD2 + 0.3
V
Input low voltage
VIL
–0.3
0.70
V
Input high current
(VIN = LVDD1, VIN = LVDD2)
IIH
—–20
μA1
Input low current
(VIN = GND)
IIL
–20
μA—
Notes:
1. LVDD1 supports eTSEC 1. LVDD2 supports eTSEC 2.
Table 26. MII Transmit AC Timing Specifications
At recommended operating conditions with LVDD of 3.3 V ± 5%.
Parameter
Symbol1
Min
Typical
Max
Unit
TX_CLK clock period 10 Mbps
tMTX
400
ns
TX_CLK clock period 100 Mbps
tMTX
—40
ns
TX_CLK duty cycle
tMTXH/tMTX
35
65
%
TX_CLK to MII data TXD[3:0], TX_ER, TX_EN delay
tMTKHDX
1
5
15
ns
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