參數(shù)資料
型號(hào)： MPC852TVR100
廠商： FREESCALE SEMICONDUCTOR INC
元件分類(lèi)： 微控制器/微處理器
英文描述： 32-BIT, 100 MHz, RISC PROCESSOR, PBGA256
封裝： PLASTIC, BGA-256
文件頁(yè)數(shù)： 56/80頁(yè)
文件大?。?/td> 2070K
代理商： MPC852TVR100
MPC852T Hardware Specifications, Rev. 3.1
6
Freescale Semiconductor
Power Dissipation
5
Power Dissipation
Table 4 provides power dissipation information. The modes are 1:1, where CPU and bus speeds are equal, and 2:1
mode, where CPU frequency is twice bus speed.
Table 3. MPC852T Thermal Resistance Data
Rating
Environment
Symbol
Value
Unit
Junction to ambient 1
1
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting
site (board) temperature, ambient temperature, air flow, power dissipation of other components on the
board, and board thermal resistance.
Natural convection
Single layer board (1s)
RθJA
2
Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal
49
°C/W
Four layer board (2s2p)
RθJMA
3
Per JEDEC JESD51-6 with the board horizontal
32
Air flow (200 ft/min)
Single layer board (1s)
RθJMA
41
Four layer board (2s2p)
RθJMA
29
Junction to board 4
4
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
RθJB
24
Junction to case 5
5
Indicates the average thermal resistance between the die and the case top surface as measured by the
cold plate method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case
temperature. For exposed pad packages where the pad would be expected to be soldered, junction to
case thermal resistance is a simulated value from the junction to the exposed pad without contact
resistance.
RθJC
13
Junction to package top 6
6
Thermal characterization parameter indicating the temperature difference between package top and the
junction temperature per JEDEC JESD51-2
Natural convection
ΨJT
3
Air flow (200 ft/min)
ΨJT
2
Table 4. Power Dissipation (PD)
Die Revision
Bus Mode
Frequency
(MHz)
Typical 1
1
Typical power dissipation is measured at 1.9 V.
Maximum 2
Unit
0
1:1
50
110
140
mW
66
150
180
mW
2:1
66
140
160
mW
80
170
200
mW
100
210
250
mW
相關(guān)PDF資料
PDF描述
MPC852TZT80 32-BIT, 80 MHz, RISC PROCESSOR, PBGA256
MPC852TZT50 32-BIT, 50 MHz, RISC PROCESSOR, PBGA256
MPC852TZT80 32-BIT, 80 MHz, RISC PROCESSOR, PBGA256
MPC852TVR100 32-BIT, 100 MHz, RISC PROCESSOR, PBGA256
MPC8533EVTALJB 32-BIT, 667 MHz, RISC PROCESSOR, PBGA783
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC852TVR100A 功能描述:微處理器 - MPU Ethernet 100 MHz RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC852TVR100A 制造商:Freescale Semiconductor 功能描述:IC COMMUNICATIONS CONTROLLER CMOS BGA
MPC852TVR50 制造商:Freescale Semiconductor 功能描述:
MPC852TVR50A 功能描述:微處理器 - MPU Ethernet 50 MHz RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC852TVR66 功能描述:IC MPU POWERQUICC 66MHZ 256-PBGA RoHS:否 類(lèi)別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC8xx 標(biāo)準(zhǔn)包裝:2 系列:MPC8xx 處理器類(lèi)型:32-位 MPC8xx PowerQUICC 特點(diǎn):- 速度:133MHz 電壓:3.3V 安裝類(lèi)型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA（25x25） 包裝:托盤(pán)
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