參數(shù)資料
型號(hào)： MPC852TZT66
廠商： 飛思卡爾半導(dǎo)體(中國(guó))有限公司
英文描述： Hardware Specifications
中文描述： 硬件規(guī)格
文件頁(yè)數(shù)： 10/80頁(yè)
文件大?。?/td> 3080K
代理商： MPC852TZT66
MPC852T Hardware Specifications, Rev. 3.1
10
Freescale Semiconductor
References
7.5 Experimental Determination
To determine the junction temperature of the device in the application after prototypes are available, the thermal
characterization parameter (
Ψ
JT
) can be used to determine the junction temperature with a measurement of the
temperature at the top center of the package case using the following equation:
T
J
= T
T
+(
Ψ
JT
x
P
D
)
where:
Ψ
JT
= thermal characterization parameter
T
T
= thermocouple temperature on top of package
P
D
= power dissipation in package
The thermal characterization parameter is measured per JESD51-2 specification published by JEDEC using a
40-gauge type T thermocouple epoxied to the top center of the package case. The thermocouple should be positioned
so that the thermocouple junction rests on the package. A small amount of epoxy is placed over the thermocouple
junction and over about 1 mm of wire extending from the junction. The thermocouple wire is placed flat against the
package case to avoid measurement errors that cooling effects of the thermocouple wire cause.
8
References
Semiconductor Equipment and Materials International(415) 964-5111
805 East Middlefield Rd
Mountain View, CA 94043
MIL-SPEC and EIA/JESD (JEDEC) specifications800-854-7179 or
(Available from Global Engineering documents)303-397-7956
JEDEC Specifications http://www.jedec.org
1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an Automotive Engine
Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47-54.
2. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance and Its
Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp. 212-220.
9
Power Supply and Power Sequencing
This section provides design considerations for the MPC852T power supply. The MPC852T has a core voltage
(V
DDL
) and PLL voltage (V
DDSYN
) that operates at a lower voltage than the I/O voltage V
DDH
. The I/O section of
the MPC852T is supplied with 3.3 V across V
DDH
and V
SS
(GND).
The signal PA[0:3], PA[8:11], PB15, PB[24:25]; PB[28:31], PC[4:7], PC[12:13], PC15] PD[3:15], TDI, TDO, TCK,
TRST, TMS, MII_TXEN, MII_MDIO are 5 V-tolerant. All inputs cannot be more than 2.5 V greater than V
DDH
. In
addition, 5 V-tolerant pins can not exceed 5.5 V, and remaining input pins cannot exceed 3.465 V. This restriction
applies to power-on reset or power down and normal operation.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC852TZT66A 功能描述:微處理器 - MPU POWER QUICC II HIP6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC852TZT80A 功能描述:微處理器 - MPU POWER QUICC II HIP6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8533EVTALF 功能描述:微處理器 - MPU PQ38K 8533E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8533EVTALFA 功能描述:微處理器 - MPU PQ38K 8533E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8533EVTANG 功能描述:微處理器 - MPU PQ38K 8533E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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