參數(shù)資料
型號: MPC8533VTALFA
廠商: Freescale Semiconductor
文件頁數(shù): 104/112頁
文件大?。?/td> 0K
描述: MPU POWERQUICC 783-PBGA
標(biāo)準(zhǔn)包裝: 36
系列: MPC85xx
處理器類型: 32-位 MPC85xx PowerQUICC III
速度: 667MHz
電壓: 0.95 V ~ 1.05 V
安裝類型: 表面貼裝
封裝/外殼: 783-BBGA,F(xiàn)CBGA
供應(yīng)商設(shè)備封裝: 783-FCPBGA(29x29)
包裝: 托盤
MPC8533E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6
Freescale Semiconductor
91
Thermal
19.6.2
Platform to FIFO Restrictions
Please note the following FIFO maximum speed restrictions based on platform speed. Refer to Section 4.4,
“Platform to FIFO Restrictions,” for additional information.
20 Thermal
This section describes the thermal specifications of the MPC8533E.
20.1
Thermal Characteristics
Table 65 provides the package thermal characteristics.
Table 64. FIFO Maximum Speed Restrictions
Platform Speed (MHz)
Maximum FIFO Speed for Reference Clocks TSECn_TX_CLK, TSECn_RX_CLK
(MHz)1
533
126
400
94
Note:
1. FIFO speed should be less than 24% of the platform speed.
Table 65. Package Thermal Characteristics
Characteristic
JEDEC Board
Symbol
Value
Unit
Notes
Junction-to-ambient natural convection
Single layer board (1s)
RJA
26
C/W
1, 2
Junction-to-ambient natural convection
Four layer board (2s2p)
RJA
21
C/W
1, 2
Junction-to-ambient (@200 ft/min)
Single layer board (1s)
RJA
21
C/W
1, 2
Junction-to-ambient (@200 ft/min)
Four layer board (2s2p)
RJA
17
C/W
1, 2
Junction-to-board thermal
RJB
12
C/W
3
Junction-to-case thermal
RJC
<0.1
C/W
4
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
2. Per JEDEC JESD51-2 and JESD51-6 with the board (JESD51-9) horizontal.
3. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
4. Thermal resistance between the active surface of the die and the case top surface determined by the cold plate method (MIL
SPEC-883 Method 1012.1) with the calculated case temperature. Actual thermal resistance is less than 0.1
C/W.
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