參數(shù)資料
型號: MPC8536EAVTANG
廠商: Freescale Semiconductor
文件頁數(shù): 48/126頁
文件大小: 0K
描述: MPU PWRQUICC III 800MHZ 783PBGA
標準包裝: 1
系列: MPC85xx
處理器類型: 32-位 MPC85xx PowerQUICC III
速度: 800MHz
電壓: 1V
安裝類型: 表面貼裝
封裝/外殼: 783-BBGA,F(xiàn)CBGA
供應(yīng)商設(shè)備封裝: 783-FCPBGA(29x29)
包裝: 托盤
MPC8536E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
Electrical Characteristics
Freescale Semiconductor
28
See Section 2.23.6.1, “SYSCLK to Platform Frequency Options,” for the full range of CCB frequencies that the chip supports.
Maximum (A)
1500
500
667
1.0
1.1
105
/ 90
7.1/6.1
5.0/4.0
1, 3, 8
Thermal (W)
5.9/4.9
5.0/4.0
1, 4, 8
Typical (W)
65
3.0
1.7
1, 2
Doze (W)
2.2
3.3
1.5
2.1
1
Nap (W)
1.1
2.1
1.5
2.1
1
Sleep (W)
1.1
2.1
1.1
1.7
1
Deep Sleep
(W)
35
0
0.6
1.2
1, 6
Notes:
1. These values specify the power consumption at nominal voltage and apply to all valid processor bus frequencies and
configurations. The values do not include power dissipation for I/O supplies.
2. Typical power is an average value measured at the nominal recommended core voltage (VDD) and 65°C junction temperature
(see Table 3) while running the Dhrystone benchmark.
3. Maximum power is the maximum power measured with the worst process and recommended core and platform voltage (VDD)
at maximum operating junction temperature (see Table 3) while running a smoke test which includes an entirely
L1-cache-resident, contrived sequence of instructions which keep the execution unit maximally busy.
4. Thermal power is the maximum power measured with worst case process and recommended core and platform voltage (VDD)
at maximum operating junction temperature (see Table 3) while running the Dhrystone benchmark.
5. VDD Core = 1.0 V for 600 to 1333 MHz, 1.1 V for 1500 MHz.
6. Maximum power is the maximum number measured with USB1, eTSEC1, and DDR blocks enabled. The Mean power is the
mean power measured with only external interrupts enabled and DDR in self refresh.
7. Mean power is provided for information purposes only and is the mean power consumed by a statistically significant range of
devices.
8. Maximum operating junction temperature (see Table 3) for Commercial Tier is 90 0C, for Industrial Tier is 105 0C.
9. Platform power is the power supplied to all the
VDD_PLAT pins.
Table 5. Power Dissipation (continued)5
Power Mode
Core
Frequen
cy
CCB
Frequen
cy
DDR
Frequen
cy
VDD
Platfor
m
VDD
Core 5
Junction
Tempera
ture
Core Power
Platform Power9
Notes
(MHz)
(V)
(
°C)
mean7
Max
mean7
Max
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