參數(shù)資料
型號： MPC8541ECPXAPDX
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 1700 MHz, RISC PROCESSOR, CBGA360
封裝： 25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, BGA-360
文件頁數(shù)： 70/84頁
文件大小： 1241K
代理商： MPC8541ECPXAPDX
MPC8541E PowerQUICC III Integrated Communications Processor Hardware Specifications, Rev. 4
72
Freescale Semiconductor
Thermal
Figure 45. Thermalloy #2328B Heat Sink-to-Ambient Thermal Resistance Versus Airflow Velocity
16.2.4.2
Case 2
Every system application has different conditions that the thermal management solution must solve. As an
alternate example, assume that the air reaching the component is 85
C with an approach velocity of 1
m/sec. For a maximum junction temperature of 105
C at 8 W, the total thermal resistance of junction to
case thermal resistance plus thermal interface material plus heat sink thermal resistance must be less than
2.5
C/W. The value of the junction to case thermal resistance in Table 49 includes the thermal interface
resistance of a thin layer of thermal grease as documented in footnote 4 of the table. Assuming that the
heat sink is flat enough to allow a thin layer of grease or phase change material, then the heat sink must be
less than 1.5
C/W.
Millennium Electronics (MEI) has tooled a heat sink MTHERM-1051 for this requirement assuming a
compactPCI environment at 1 m/sec and a heat sink height of 12 mm. The MEI solution is illustrated in
Figure 46 and Figure 47. This design has several significant advantages:
The heat sink is clipped to a plastic frame attached to the application board with screws or plastic
inserts at the corners away from the primary signal routing areas.
The heat sink clip is designed to apply the force holding the heat sink in place directly above the
die at a maximum force of less than 10 lbs.
For applications with significant vibration requirements, silicone damping material can be applied
between the heat sink and plastic frame.
1
3
5
7
8
00.511.522.533.5
Thermalloy #2328B Pin-fin Heat Sink
Approach Air Velocity (m/s)
Hea
tSink
Th
er
ma
lResistance
(
°C/W)
(25
× 28 × 15 mm)
2
4
6
相關(guān)PDF資料
PDF描述
MPC8541EVTALEX 32-BIT, 667 MHz, RISC PROCESSOR, PBGA783
MPC8541EPXAPDX 32-BIT, 833 MHz, RISC PROCESSOR, PBGA783
MPC8541EVTAPFX 32-BIT, 833 MHz, RISC PROCESSOR, PBGA783
MPC8541EPXAJEX 32-BIT, 1420 MHz, RISC PROCESSOR, CBGA360
MPC8541EVTAKEX 32-BIT, 1000 MHz, RISC PROCESSOR, CBGA360
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8541ECVTAJD 功能描述:微處理器 - MPU PQ 37 LITE 8555E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8541ECVTAJD 制造商:Freescale Semiconductor 功能描述:Microprocessor
MPC8541ECVTALF 功能描述:微處理器 - MPU PQ 37 LITE 8555E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8541EPXAJD 功能描述:微處理器 - MPU PQ 37 LITE 8555E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8541EPXAKE 功能描述:微處理器 - MPU PQ 37 LITE 8541E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報(bào)價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報(bào)價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*