參數(shù)資料
型號(hào): MPC8541EPXAKE
廠商: Freescale Semiconductor
文件頁(yè)數(shù): 7/88頁(yè)
文件大?。?/td> 0K
描述: IC MPU POWERQUICC III 783-FCPBGA
標(biāo)準(zhǔn)包裝: 36
系列: MPC85xx
處理器類型: 32-位 MPC85xx PowerQUICC III
速度: 600MHz
電壓: 1.2V
安裝類型: 表面貼裝
封裝/外殼: 783-BBGA,F(xiàn)CBGA
供應(yīng)商設(shè)備封裝: 783-FCPBGA(29x29)
包裝: 托盤
配用: CWH-PPC-8540N-VE-ND - KIT EVAL SYSTEM MPC8540
MPC8541E PowerQUICC III Integrated Communications Processor Hardware Specification, Rev. 4.2
Freescale Semiconductor
15
RESET Initialization
4.3
Real Time Clock Timing
Table 8 provides the real time clock (RTC) AC timing specifications.
5
RESET Initialization
This section describes the AC electrical specifications for the RESET initialization timing requirements of
the MPC8541E. Table 9 provides the RESET initialization AC timing specifications.
Table 10 provides the PLL and DLL lock times.
Table 8. RTC AC Timing Specifications
Parameter/Condition
Symbol
Min
Typical
Max
Unit
Notes
RTC clock high time
tRTCH
2 x
tCCB_CLK
——
ns
RTC clock low time
tRTCL
2 x
tCCB_CLK
——
ns
Table 9. RESET Initialization Timing Specifications
Parameter/Condition
Min
Max
Unit
Notes
Required assertion time of HRESET
100
μs—
Minimum assertion time for SRESET
512
SYSCLKs
1
PLL input setup time with stable SYSCLK before HRESET
negation
100
μs—
Input setup time for POR configs (other than PLL config) with
respect to negation of HRESET
4
SYSCLKs
1
Input hold time for POR configs (including PLL config) with
respect to negation of HRESET
2
SYSCLKs
1
Maximum valid-to-high impedance time for actively driven POR
configs with respect to negation of HRESET
5
SYSCLKs
1
Notes:
1. SYSCLK is identical to the PCI_CLK signal and is the primary clock input for the MPC8541E. See the
MPC8555E
PowerQUICC III Integrated Communications Processor Reference Manual for more details.
Table 10. PLL and DLL Lock Times
Parameter/Condition
Min
Max
Unit
Notes
PLL lock times
100
μs—
DLL lock times
7680
122,880
CCB Clocks
1, 2
Notes:
1. DLL lock times are a function of the ratio between the output clock and the platform (or CCB) clock. A 2:1 ratio results in the
minimum and an 8:1 ratio results in the maximum.
2. The CCB clock is determined by the SYSCLK
× platform PLL ratio.
相關(guān)PDF資料
PDF描述
IDT70V3599S133BC8 IC SRAM 4MBIT 133MHZ 256BGA
MPC8541CPXAJD IC MPU 32BIT 1.0GHZ 783-FCPBGA
IDT70V3319S133BF8 IC SRAM 4MBIT 133MHZ 208FBGA
MPC8540VTAQFB IC MPU 32BIT 1.0GHZ 783-FCPBGA
IDT70V3319S133BC8 IC SRAM 4MBIT 133MHZ 256BGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8541EPXALF 功能描述:微處理器 - MPU PQ 37 LITE 8555E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8541EPXAPF 功能描述:微處理器 - MPU PQ 37 LITE 8555E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8541EPXAQF 功能描述:微處理器 - MPU PQ 37 LITE 8555E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8541EVTAJD 功能描述:微處理器 - MPU PQ 37 LITE 8555E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8541EVTAKE 功能描述:微處理器 - MPU PQ 37 LITE 8541E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324