參數(shù)資料
型號(hào): MPC8544CVTAQG
廠商: Freescale Semiconductor
文件頁數(shù): 42/117頁
文件大?。?/td> 0K
描述: MPU POWERQUICC III 783-PBGA
標(biāo)準(zhǔn)包裝: 36
系列: MPC85xx
處理器類型: 32-位 MPC85xx PowerQUICC III
速度: 1.0GHz
電壓: 0.95 V ~ 1.05 V
安裝類型: 表面貼裝
封裝/外殼: 783-BBGA,F(xiàn)CBGA
供應(yīng)商設(shè)備封裝: 783-FCPBGA(29x29)
包裝: 托盤
MPC8544E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6
30
Freescale Semiconductor
Enhanced Three-Speed Ethernet (eTSEC), MII Management
Figure 10 provides the AC test load for SGMII.
Figure 10. SGMII AC Test/Measurement Load
8.5
FIFO, GMII,MII, TBI, RGMII, RMII, and RTBI AC Timing
Specifications
The AC timing specifications for FIFO, GMII, MII, TBI, RGMII, RMII, and RTBI are presented in this
section.
8.5.1
FIFO AC Specifications
The basis for the AC specifications for the eTSEC FIFO modes is the double data rate RGMII and RTBI
specifications, since they have similar performance and are described in a source-synchronous fashion like
FIFO modes. However, the FIFO interface provides deliberate skew between the transmitted data and
source clock in GMII fashion.
When the eTSEC is configured for FIFO modes, all clocks are supplied from external sources to the
relevant eTSEC interface. That is, the transmit clock must be applied to the eTSECn TSECn_TX_CLK,
while the receive clock must be applied to pin TSECn_RX_CLK. The eTSEC internally uses the transmit
clock to synchronously generate transmit data and outputs an echoed copy of the transmit clock back out
onto the TSECn_GTX_CLK pin (while transmit data appears on TSECn_TXD[7:0], for example). It is
intended that external receivers capture eTSEC transmit data using the clock on TSECn_GTX_CLK as a
source-synchronous timing reference. Typically, the clock edge that launched the data can be used, since
the clock is delayed by the eTSEC to allow acceptable set-up margin at the receiver.
A summary of the FIFO AC specifications appears in Table 28 and Table 29.
Table 28. FIFO Mode Transmit AC Timing Specification
At recommended operating conditions with L/TVDD of 3.3 V ± 5% or 2.5 V ± 5%
Parameter/Condition
Symbol
Min
Typ
Max
Unit
Notes
TX_CLK, GTX_CLK clock period
tFIT
—8.0
ns
TX_CLK, GTX_CLK duty cycle
tFITH
45
50
55
%
TX_CLK, GTX_CLK peak-to-peak jitter
tFITJ
——
250
ps
Rise time TX_CLK (20%–80%)
tFITR
0.75
ns
TX
Silicon
+ Package
C = CTX
R = 50
Ω
R = 50
Ω
D+ Package
Pin
D– Package
Pin
D+ Package
Pin
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