參數(shù)資料
型號: MPC8545EHXATG
廠商: Freescale Semiconductor
文件頁數(shù): 53/151頁
文件大?。?/td> 0K
描述: IC MPU PWRQUICC III 783-FCCBGA
標(biāo)準(zhǔn)包裝: 1
系列: MPC85xx
處理器類型: 32-位 MPC85xx PowerQUICC III
速度: 1.2GHz
電壓: 1.1V
安裝類型: 表面貼裝
封裝/外殼: 783-BBGA,F(xiàn)CBGA
供應(yīng)商設(shè)備封裝: 783-FCPBGA(29x29)
包裝: 托盤
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
146
Freescale Semiconductor
Ordering Information
MPC
8545E
Blank = 0 to 105
C
C = –40
to 105C
HX = CBGA
VU = Pb-free CBGA
PX = PBGA
VT = Pb-free PBGA
AT = 1200
AQ = 1000
AN = 800
G = 400
Blank = Ver. 2.0
(SVR = 0x80390220)
A = Ver. 2.1.1
B = Ver. 2.1.2
D = Ver. 3.1.x
(SVR = 0x80390231)
8545
Blank = Ver. 2.0
(SVR = 0x80310220)
A = Ver. 2.1.1
B = Ver. 2.1.2
D = Ver. 3.1.x
(SVR = 0x80310231)
8543E
AQ = 1000
AN = 800
Blank = Ver. 2.0
(SVR = 0x803A0020)
A = Ver. 2.1.1
B = Ver. 2.1.2
D = Ver. 3.1.x
(SVR = 0x803A0031)
8543
Blank = Ver. 2.0
(SVR = 0x80320020)
A = Ver. 2.1.1
B = Ver. 2.1.2
D = Ver. 3.1.x
(SVR = 0x80320031)
Notes:
1. See Section 19, “Package Description,” for more information on available package types.
2. The HiCTE FC-CBGA package is available on only Version 2.0 of the device.
3. The FC-PBGA package is available on only Version 2.1.1, 2.1.2, and 2.1.3 of the device.
4. Processor core frequencies supported by parts addressed by this specification only. Not all parts described in this
specification support all core frequencies. Additionally, parts addressed by part number specifications may support other
maximum core frequencies.
5. This speed available only for silicon Version 2.1.1, 2.1.2, and 2.1.3.
Table 87. Part Numbering Nomenclature (continued)
MPC
nnnnn
t
pp
ff
c
r
Product
Code
Part
Identifier
Temperature
Package1, 2, 3
Processor
Frequency4
Core
Frequency
Silicon Version
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MPC8545EPXAQGA 功能描述:微處理器 - MPU PQ3 8545E Imaging Processor RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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