參數(shù)資料
型號： MPC8547EHXAQJB
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 1000 MHz, MICROPROCESSOR, CBGA783
封裝： 29 X 29 MM, 1 MM PITCH, FLIP CHIP, CERAMIC, BGA-783
文件頁數(shù)： 63/142頁
文件大?。?/td> 1504K
代理商： MPC8547EHXAQJB
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
Freescale Semiconductor
27
Enhanced Three-Speed Ethernet (eTSEC)
8.2
FIFO, GMII, MII, TBI, RGMII, RMII, and RTBI AC Timing
Specifications
The AC timing specifications for FIFO, GMII, MII, TBI, RGMII, RMII, and RTBI are presented in this
section.
8.2.1
FIFO AC Specifications
The basis for the AC specifications for the eTSEC’s FIFO modes is the double data rate RGMII and RTBI
specifications, since they have similar performances and are described in a source-synchronous fashion
like FIFO modes. However, the FIFO interface provides deliberate skew between the transmitted data and
source clock in GMII fashion.
When the eTSEC is configured for FIFO modes, all clocks are supplied from external sources to the
relevant eTSEC interface. That is, the transmit clock must be applied to the eTSECn’s TSECn_TX_CLK,
while the receive clock must be applied to pin TSECn_RX_CLK. The eTSEC internally uses the transmit
clock to synchronously generate transmit data and outputs an echoed copy of the transmit clock back out
onto the TSECn_GTX_CLK pin (while transmit data appears on TSECn_TXD[7:0], for example). It is
intended that external receivers capture eTSEC transmit data using the clock on TSECn_GTX_CLK as a
source- synchronous timing reference. Typically, the clock edge that launched the data can be used, since
the clock is delayed by the eTSEC to allow acceptable set-up margin at the receiver. Note that there is
relationship between the maximum FIFO speed and the platform speed. For more information see
Table 23. GMII, MII, RMII, TBI, RGMII, RTBI, and FIFO DC Electrical Characteristics
Parameters
Symbol
Min
Max
Unit
Notes
Supply voltage 2.5 V
LVDD/TVDD
2.37
2.63
V
1, 2
Output high voltage (LVDD/TVDD = Min,
IOH = –1.0 mA)
VOH
2.00
LVDD/TVDD + 0.3
V
—
Output low voltage (LVDD/TVDD = Min,
IOL = 1.0 mA)
VOL
GND –0.3
0.40
V
—
Input high voltage
VIH
1.70
LVDD/TVDD + 0.3
V
—
Input low voltage
VIL
–0.3
0.90
V
—
Input high current (VIN = LVDD, VIN = TVDD)IIH
—10
μA
1, 2, 3
Input low current (VIN = GND)
IIL
–15
—
μA3
Notes:
1. LVDD supports eTSECs 1 and 2.
2. TVDD supports eTSECs 3 and 4.
3. Note that the symbol VIN, in this case, represents the LVIN and TVIN symbols referenced in Table 1 and Table 2.
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MPC8547EPXAQGA 功能描述:微處理器 - MPU PQ3 8547E Storage Processor RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8547EPXAQGB 功能描述:微處理器 - MPU FG PQ38 8548 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8547EPXAQGD 功能描述:微處理器 - MPU PQ38 PB ST WE 1000 R3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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